Melexis introduces new magnetic position sensor chips

     Melexis has added two new devices to its line of contactless position sensor chips - the MLX90421 and MLX90422. Both devices are based on the company's proprietary Triaxis high-precision magnetic induction technology. These chips are designed for cost-sensitive automotive applications such as powertrain actuators, pedal positioning systems, fuel level gauges and transmission systems. Although equally suitable for industrial applications, it has superior capabilities in terms of functional safety and electromagnetic compatibility (EMC) characteristics. In addition, the chip supports high temperature operation.

     In addition to magnetic induction components, the new position sensing chip has built-in data conversion and digital signal processing modules, and is equipped with a programmable output-stage driver. When properly configured, the chip can accurately determine rotational or linear position. The MLX90421 provides ratiometric analog output or pulse width modulation (PWM) output, and the MLX90422 supports output compliant with the SAE J2716 single Side Half byte Transfer (SENT) protocol.

     The operating ambient temperature range of the two chips extends from -40°C to 160°C, which means they can be deployed in the more heated power compartment, in line with the trend of engine miniaturization in the automotive industry. The sensor chip fully complies with the ISO26262 Functional Safety guidelines and supports the ASIL-B safety level through a Separate Safety unit (SEooC). To ensure a successful EMC test, the new chip follows the proven design of the Melexis MLX9037x product family. As a result, these chips require only one test cycle, which means that the design process takes less time and can minimize engineering costs. Improvements in absolute maximum rating (AMR), such as -18V/-34V output protection and -18/-37V power supply protection, reduce the risk of electrical overload.

     The MLX90421 and MLX90422 are available in single-chip packages in SOIC-8 and PCB-free DMP-4 forms. These package options are backward compatible with the company's earlier devices, enabling direct replacement. For safety-critical applications that require system redundancy, the chip also supports fully redundant dual-chip TSSOP-16 packages.