
Global microelectronics engineering company Melexis has added two new devices to its family of contactless position sensor chips, the MLX90421 and MLX90422. Both devices introduced are based on the company's proprietary Triaxis high-precision magnetic induction technology. The chips are designed for cost-sensitive automotive applications such as powertrain actuators, pedal positioning systems, fuel level gauges and transmission systems. Although equally suitable for industrial applications, it has superior capabilities in terms of functional safety and electromagnetic compatibility (EMC) characteristics. In addition, the chip supports high temperature operation.
In addition to the magnetic induction element, the new position sensor chip also has built-in data conversion and digital signal processing modules, and is equipped with a programmable output stage driver. When properly configured, the chip can accurately determine rotational or linear position. The MLX90421 provides a ratiometric analog output or a pulse width modulation (PWM) output, and the MLX90422 supports an output compliant with the SAE J2716 Single-Edge Nibble Transfer (SENT) protocol.
The operating ambient temperature range of the two chips is extended to -40°C to 160°C, which means they can be deployed in hotter power compartments, in line with the trend of engine downsizing in the automotive industry. The sensor chip fully complies with ISO26262 functional safety guidelines and supports ASIL-B safety level through Safety Independent Element (SEooC). To ensure first-time EMC testing, the new chips follow the proven design of the Melexis MLX9037x product family. As a result, these chips require only one test cycle, which means a shorter design process and maximal engineering cost savings. Improvements in Absolute Maximum Ratings (AMR), such as -18V/-34V output protection and -18/-37V supply protection, reduce the risk of electrical overload.
The MLX90421 and MLX90422 are available in single-chip packages in SOIC-8 and PCB-less DMP-4 formats. These package options are backward compatible with the company's earlier devices, enabling drop-in replacements. For safety-critical applications requiring system redundancy, the chip also supports a fully redundant dual-chip TSSOP-16 package.
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