Melexis Announces New Development Kit: Easy Contactless Current Sensing Evaluation

     Two new development kits from Melexis allow engineers to explore the capabilities of Melexis current sensor chips, reducing customer development time and accelerating project completion. One of the development kits can test chips with IMC-Hall® technology (with or without shield); the other can test chips with traditional core-based Hall technology. With these two development kits, engineers can verify hardware with different sensor capabilities to easily handle different current sensing ranges.

     Both new development kits come with multiple Melexis current sensor chips, allowing engineers to test different magnetic configurations and chips, saving time and effort during the selection phase. Development kits for IMC-Hall technology come with MLX91208 and MLX91216 chips and the recently released MXL91218 chip; development kits for traditional Hall technology come with MLX91209, MLX91211, MLX91217 and MLX91219 chips. The above basically covers all of our second-generation IMC and traditional Hall-type current sensor chips.

     The new development kit comes with a 3D printed bracket to hold the shield and magnetic core (if applicable) in place. Engineers do not need to build fixtures themselves, saving time and effort. The materials used are able to withstand higher temperatures (170°C). Both development kits also come with copper bars to simplify installation.

     “These two new development kits provide engineers with a system design that makes their job easier. There is no need to build their own configuration or source materials from different suppliers,” said Bruno Boury, product line manager for current sensor chips. . “Using these two development kits and the various components that come with them, engineers can easily and quickly evaluate the operating parameters of the system, and then select the ideal current sensor chip from the Melexis portfolio for their specific needs. This enables better Realize design concepts and accelerate time-to-market.”