Lam Group Releases Syndion GP to Meet Chip Makers' Demand for Advanced Power Devices

     In Fremont, California, Lam Group announced its new product, Syndion® GP, which provides chipmakers with deep silicon etch technology to develop next-generation power devices and power management integrated circuits for the automotive, power transmission and energy industries.

     As technologies in these fields become more advanced, there is an increasing demand for higher power, better performance, and larger capacity of chips, which requires further improvements in cross-wafer uniformity of higher aspect ratio structures. These improvements can be achieved through the use of advanced device structures without sacrificing form factor. To do this, device manufacturers need extremely precise and uniform deep silicon etch processes.

     The Syndion GP was created to support this precision manufacturing process. It can be deployed on fabricated devices on 200mm and 300mm wafers, simplifying transition paths and increasing capacity. Currently, many power devices use 200mm diameter silicon wafers; however, to meet growing demand, production is gradually shifting to 300mm wafers.

     Syndion GP solutions are based on Lam's industry-leading deep silicon etching technology, and a series of special technology products are derived. Specialty technology products refer to power devices, microelectromechanical systems (MEMS), analog and mixed-signal semiconductors, radio frequency IC (RF) solutions, optoelectronic devices, and CMOS image sensors (CIS), which support products including electric vehicles, IoT, and Consumer and industrial technologies and applications including 5G.

     "Demand for specialty devices continues to grow rapidly today," said Pat Lord, executive vice president, Customer Support and Global Operations, Lam Group. "Working closely with our customers, we've discovered that customers need to accelerate the use of 300mm wafers for advanced power manufacturing. The path to the device. Syndion GP can meet the growing needs of chipmakers while supporting continued innovation from breakthroughs in specialty technologies.”

      Lam's deep silicon etch portfolio includes the production-proven 200mm DSiE™ platform and the market-leading 300mm Syndion GS for the packaging, hybrid memory and CMOS image sensor markets, and the Syndion GP complements the entire portfolio . Syndion GP has the flexibility to meet the precision control and yield ramp-up required for high-volume manufacturing processes, embodying the diverse deep silicon etch solutions necessary to address the challenges of next-generation devices.