Laird Connectivity's flexible modules accelerate time-to-market for Bluetooth LE-enabled IoT designs

     Laird Connectivity's Lyra series of Bluetooth 5.3 modules are built on Silicon Labs' EFR32BG22 SoC. These flexible modules combine all the benefits of Silicon Labs hardware, software and tools with Laird Connectivity's value-added application software, services, certification and support capabilities. This seamless partnership provides customers with a variety of software development options that are tailored to the customer's resources and skill sets in developing Bluetooth LE-enabled products. The Lyra family includes small PCB modules and ultra-compact SiP options to fit any motherboard footprint. Together, Silicon Labs and Laird Connectivity reduce total cost of ownership, design complexity and risk while ensuring fast time-to-market for Bluetooth LE-enabled IoT designs.

    The Lyra series modules are designed and certified for the maximum industrial temperature range of -40°C to +105°C for every element used. They are ideal for battery-powered IoT with smart power schemes, deep sleep mode, and low power consumption, enabling long-term IoT performance even on battery power