KC-LINK with KONNEKT technology

     KEMET's KC-LINK surface mount capacitors with KONNEKT technology are designed for high efficiency and high density power supply applications. KONNEKT technology uses innovative transient liquid phase sintering (TLPS) materials to create surface mount multi-chip solutions for high density packaging. By leveraging KEMET's robust and proprietary C0G base metal inner electrode (BME) dielectric system, these capacitors are ideal for power converters, inverters, snubber circuits and resonator applications where energy efficiency is a primary consideration.

     KONNEKT technology enables a low loss, low inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible capacitance versus temperature change. At +150°C operating temperature, these capacitors can be mounted near fast switching semiconductors in high power density applications with minimal cooling. Compared to other dielectric technologies, KC-LINK's KONNEKT dielectric technology is also highly mechanically robust, allowing capacitors to be mounted without the use of a metal frame.

     If these capacitors are installed in a low loss orientation, the power handling capability can be further improved. Low-loss orientation reduces effective series resistance (ESR) and effective series inductance (ESL), improving ripple current handling