Infineon introduces two new packages in the OptiMOS power MOSFET TOLx family

     Applications such as electric scooters, forklifts and other light electric vehicles (LeVs), as well as electric hand tools and battery management systems require high current ratings, ruggedities and long service lives. Infineon Technologies offers power system designers more options to meet their different design needs and deliver the highest performance in the smallest space.

     Infineon introduces two new packages in the OptiMOS power MOSFET TOLx family with the innovative To-Leadless (TOLL) package: TOLG (TO wire with Gull-wing wire) and TOLT (TO wire top cooling). The TOLx series all feature extremely low R DS(on) and high current ratings in excess of 300 A to improve system efficiency in high power density designs.

     The TOLG package combines the best features of the TOLL and the D2PAK 7 pin package, sharing the same 10 x 11 mm 2 base surface and electrical performance as the TOLL, with added flexibility compatible with the D2PAK 7 pin. The main advantages of TOLG are particularly evident when designing with aluminum insulated metal substrates (Al-IMS). In these designs, the coefficient of thermal expansion (CTE), which describes the tendency of the material to change shape as the temperature changes, is higher than that of copper IMS and FR4 boards.

     Over time, temperature cycling (TCoB) on the board can cause cracks in the weld points between the package and the PCB. With the flexibility of gull wing wires, TOLG demonstrates excellent weld point durability, significantly increasing product reliability in applications where repeated temperature cycles occur. The new package delivers twice the TCoB performance required by the IPC-9701 standard.

     The TOLT package is optimized for excellent thermal performance. The package is structurally flipped up and down with exposed metal at the top, and has multiple gull-wing wires on each side to provide a high current-carrying drain to source connection. In a frame where the wires are flipped up and down, heat passes from the exposed metal tip through the insulation and directly to the heat sink. Compared to the TOLL bottom-cooled package, TOLT's R thJA improved by 20% and R thJC by 50%. These specifications reduce system material costs, especially heat sinks. In addition, since components can now be mounted on the bottom of the MOSFETs, OptiMOS in TOLT packaging are able to reduce PCB space.