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Infineon introduces the industry's first QML-V compliant radiation-hardened NOR flash memory for aerospace-grade FPGAs

May 21 2022 2022-05 Semiconductors Infineon Technologies
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Infineon Technologies LLC, a unit of Infineon Technologies Inc., announced the launch of the industry's first High Capacity Radiation-resistant (RadTol) NOR flash memory product, which is certified for the MIL-PRF-38535 QML-V process. The QML-V process is certified to the highest quality and reliability standards for aerospace grade ics.

     Space-grade programmable logic devices (FPGAs) require reliable, high-capacity non-volatile memory containing their boot configuration. To meet the growing demand for high-reliability memory, Infineon Technologies LLC, a subsidiary of Infineon Technologies AG, has announced the industry's first high-capacity radiation-hardened (RadTol) NOR flash memory product that passes MIL-PRF-38535 QML -V Process Certification. The QML-V process is the highest quality and reliability standard certification for aerospace-grade ICs.

     Infineon's 256 Mb and 512 Mb RadTol NOR Flash non-volatile memories enable an excellent low pin count single-chip solution for applications such as FPGA configuration, image storage, microcontroller data and boot code storage . When used at higher clock rates, the device supports data transfers that rival or exceed traditional parallel asynchronous NOR flash while significantly reducing pin count. The device is radiation hardened up to 30 krad (Si) biased and 125 krad (Si) unbiased. The device has an endurance of 1000 program/erase cycles at 125°C with a data retention period of 30 years, and 10,000 program/erase cycles at 85°C with a data retention period of 250 years.

     As a leader in aerospace-grade memory products, Infineon has developed RadTol 256 Mb Quad SPI (QSPI) and 512 Mb Dual Quad SPI NOR Flash using 65 nm floating gate flash process technology. Both have 133 MHz SDR interface speed. The 512 Mb device consists of two separate 256 Mb dies assembled side-by-side in a single package solution. This gives designers the flexibility to run the device independently in dual-QSPI or single-QSPI mode on either die, giving them the option to use the second die as a backup solution. Infineon is working closely with leading FPGA ecosystem companies such as Xilinx for aerospace-grade applications.

     "Our radiation-hardened dual-QSPI nonvolatile memories are fully supported by the latest aerospace-grade FPGAs," said Helmut Puchner, vice president of aerospace and defense business at Infineon Technologies LLC. "They can lead to an excellent low pin count single-chip solution to Configure the processor and FPGA."

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