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Infineon introduces high-density power modules to provide benchmark performance for AI data centers and reduce total cost of ownership

Mar 17 2024 2024-03 Connectors Infineon Technologies
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Artificial intelligence (AI) is driving a doubling of global data generation, driving the increasing demand for energy for the chips that support this data growth. Infineon Technologies AG has launched the TDM2254xD series of biphase power modules to provide improved power density, quality and total cost (TCO) for AI data centers.

     Artificial intelligence (AI) is driving a doubling of global data generation, driving the increasing demand for energy for the chips that support this data growth. Infineon Technologies AG has launched the TDM2254xD series of biphase power modules to provide improved power density, quality and total cost (TCO) for AI data centers.

 

     The TDM2254xD series combines powerful OptiMOSTM MOSFET technology innovations with new packaging and proprietary magnetic construction to deliver industry-leading electrical and thermal performance through a robust mechanical design. It improves the operational efficiency of the data center and significantly reduces the total cost of ownership while meeting the high power requirements of the AI GPU (graphics processor unit) platform.

 

     Given that AI servers consume up to three times more energy than traditional servers, and that data centers already consume more than 2% of the world's energy supply, innovative power solutions and architectural designs need to be found to further drive decarbonization. Infineon's TDM2254xD biphase power module combined with XDPTM controller technology, a high-performance computing platform with superior electrical, thermal and mechanical operational performance, provides efficient voltage regulation, laying the foundation for a green AI factory.

 

     Infineon officially launched the TDM2254xD series at the International Power Electronics Applications Show (APEC) in the US. The unique design of the modules enables efficient heat transfer from the power stage to the heat sink through a new inductor design optimized for current and heat transfer, resulting in modules that are 2% more efficient than the industry average at full load. Improving the energy efficiency of GPU cores can achieve significant energy savings at scale. This will save several megawatts of power for data centers that compute generative AI, which in turn will reduce CO2 emissions and save millions of dollars in operating costs over the life of the system.

 

     Athar Zaidi, Senior Vice president, Power and Sensing Systems, Infineon Technologies, said: "By combining this unique semiconductor product-to-system solution with our leading-edge manufacturing technologies, Infineon is able to deliver solutions with differentiated performance and quality at scale, significantly reducing the total cost of ownership for our customers. We are excited to introduce this solution, which will optimize computing performance and further help us fulfill our mission of digitization and decarbonization."

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