Infineon enhances 1200 V EconoDUAL 3 portfolio with IGBT7 with new current rating, flexible for higher power density and performance

     Infineon Technologies AG has introduced new current ratings for its EconoDUAL 3 product portfolio with TRENCHSTOP IGBT7 chips. With a wide range of current ratings from 300A to 900A, this product portfolio offers inverter designers a high degree of flexibility while also delivering higher power density and performance. In addition to solar and drive applications, the product portfolio is tailored for commercial, construction and agricultural vehicles (CAV) and uninterruptible power supply (UPS) inverters.

     Based on the new micro-trench technology, the EconoDUAL 3 with the TRENCHSTOP IGBT7 chip has much lower static losses compared to modules with the IGBT4 chipset. In addition, under the same chip area, its on-state voltage is reduced by 30%. This brings significant loss reduction in applications, especially for industrial drives that typically operate at moderate switching frequencies. Both the oscillation behavior and controllability of the IGBT are improved. In addition, the new power module has a maximum overload junction temperature of 175°C.

     The new chip size enables the module layout to be optimized to reduce switching losses. As a result, the switching losses of the 600A module are reduced by 24% compared to the previous generation. This results in a simplified design for higher switching frequency applications. In addition, all functions can be implemented on the same package substrate size, which facilitates the upgrade of existing inverter system designs. With the expansion of the 750A and 900A versions, the EconoDUAL 3 package addresses an extended inverter power range. Additionally, the PressFIT package enables a fast and low-cost assembly method.