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Infineon Introduces New AIROC CYW20829 Bluetooth Low Energy System-on-Chip

Feb 22 2022 2022-02 Semiconductors Infineon Technologies
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Infineon Technologies Inc. will launch the AIROC CYW20829 low power Bluetooth on-chip system. The solution supports the latest Bluetooth 5.3 core specification for iot, smart home, and industrial applications. AIROC CYW20829 combines low power and excellent performance to support all low power Bluetooth application scenarios, including smart homes, sensors, lighting, Bluetooth Mesh, remote controls, and other iot applications connected via low power Bluetooth.

     Infineon Technologies AG will launch the AIROC CYW20829 Bluetooth Low Energy System-on-Chip. The solution supports the latest Bluetooth 5.3 core specification for IoT, smart home and industrial applications. AIROC CYW20829 combines low power consumption with excellent performance to support all Bluetooth low energy application scenarios, including smart home, sensors, lighting, Bluetooth mesh, remote control and other IoT applications connected via Bluetooth low energy.

     Sonal Chandrasekharan, Vice President of the Bluetooth Product Line at Infineon Technologies, said: “Designers can easily create products with low power consumption and outstanding performance using the Infineon AIROC CYW20829 Bluetooth Low Energy System-on-Chip. It has a high-efficiency MIPS processor designed with a low-leakage process, and integrates a low-power Bluetooth radio. In addition, it also has excellent RF performance, which can provide a stable and reliable connection, which in turn provides users with smart connected devices. A great experience."

     The AIROC CYW20829 integrates a power amplifier with an output power of 10 dBm, the receive sensitivity of LE is -98.5 dBm, and the receive sensitivity of LE-LR is -106 dBm at 125 Kbps rate, which has a better chain in the AIROC Bluetooth product portfolio road budget. CYW20829 has first-class RF performance, can provide stable and reliable connection, and has extremely low power consumption. Ideal for applications.

     CYW20829 is the first Infineon AIROC Bluetooth SoC with ARM®Cortex®M33 core. This Bluetooth low energy system-on-chip integrates a highly optimized radio and a Bluetooth microcontroller based on the ARM Cortex M33 core, enabling a design with low current consumption. The second ARM Cortex M33 core features a floating-point unit (FPU), which is specially adapted for customer's application scenarios, with a main frequency of up to 96 MHz, which can provide excellent computing performance on the basis of low power consumption.

     The AIROC CYW20829 is highly integrated with a configurable serial communication module, multiple timers/counters and pulse width modulators, as well as I2S, PDM, CAN and LIN interfaces. Among them, the serial communication module can be configured as UART/I2C/SPI as required. The platform architecture has built-in ROM-based trust root, TRNG, and eFuse-based specific key and cryptographic operation hardware acceleration technology, with higher security. AIROC CYW20829 also supports code execution directly from external flash memory and on-the-fly encryption of the content on the flash memory, so it is more flexible.

     AIROC CYW20829 is fully software supported by ModusToolbox. And ModusToolbox can provide a series of easy-to-use software and special tools to help developers quickly develop IoT solutions based on Bluetooth technology. Visit the Infineon Developer Community to communicate and communicate with application support engineers online and receive technical support to deploy AIROC Bluetooth and multi-protocol SoCs.

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