EPC Power Design Tool Helps Engineers Shorten GaN Power System Design Cycles

EPC Corporation announced the launch of the GaN Power Bench design tool to help engineers achieve the highest performance in GaN-based device designs. eGaN FETs and ICs offer fast switching, high efficiency and small size to meet the stringent power density requirements of today's leading edge applications. The GaN Power Bench tool helps design engineers select the most suitable GaN device for a variety of applications, simulate and optimize the thermal performance of the design, and provides application examples and related documentation to quickly and easily achieve the desired performance of the design.

GaN Power Bench tools include:

GaN FET Selection Tool for Buck Converters

The GaN FET Sizing Calculator for Buck Converters is a further improved product selection tool for estimated and calculated values for hard-switched buck converters. After the designer enters the design parameters, the optional devices are derived in order of power consumption, thereby determining the trade-off of the parameters. This selection tool is designed to find the most suitable GaN FET to meet the requirements of a specific power system design. This tool will further incorporate other topologies.

GaN FET Thermal Calculator

The GaN FET Thermal Calculator provides quick estimates of thermal performance parameters for GaN devices on PCBs. GaN devices require both boardside cooling by forced convection and backside cooling with a thermal solution consisting of a heat sink and heat sink. The thermal calculator estimates take into account the PCB structure (dimension, stacking and via density), die size, power dissipation, TIM material and heat sink solution.

cross reference search

Cross Reference Search provides cross references and GaN FET alternatives for many silicon-based power management devices, making it easy to compare parametric differences without needing a datasheet to find the most suitable eGaN FET to improve design efficiency. Simply enter a competitor's part number to find recommended GaN replacements for silicon devices.

Device model

EPC has developed a list of third-order device models that allow engineers to quickly design and build circuits. Models for each device include PSpice, LTSpice, TSpice, Spectre, Altium, 3DStep, and thermal models.