Disrupting digital vision: STMicroelectronics pioneers 500,000-pixel depth image ToF sensor

      The first product in the new 3D series is the VD55H1. The sensor can perform 3D imaging by sensing the distance of more than 500,000 points. Objects within 5 meters of the sensor are detected, and even further objects can be detected with the patterned lighting system. The VD55H1 can address usage scenarios in emerging AR/VR markets, including room images, games, and 3D avatars. In smartphones, the new sensor could enhance the capabilities of the camera system, including bokeh effects, multi-camera selection and video splitting. Higher resolution and more accurate 3D images also improve the security of face authentication, better protecting cell phone unlocking, mobile payments and any smart systems involved in secure transactions and access control. In robotics, the VD55H1 provides high-fidelity 3D scene graphs for all target distances for new and enhanced capabilities.

     "The innovative VD55H1 3D depth sensor strengthens ST's presence in the time-of-flight technology market and complements our depth-sensing technology portfolio," said Eric Aussedat, Executive Vice President, General Manager, Imaging, STMicroelectronics. Now, FlightSense™ The portfolio includes direct and indirect ToF products ranging from single-point ranging all-in-one sensors to sophisticated high-resolution 3D imagers, enabling the next generation of intuitive smart autonomous devices."

      Indirect time-of-flight (iToF) sensors, such as the VD55H1, calculate the distance between the sensor and the object by measuring the phase shift between the reflected and transmitted signal, while direct time-of-flight (dToF) sensor technology measures the reflected signal after it is emitted Time to go back to the sensor. ST's broad portfolio of advanced technologies enables the design of direct and indirect high-resolution ToF sensors, with optimized solutions tailored to specific application requirements.

      VD55H1's unique pixel architecture and manufacturing process, combined with STMicroelectronics' 40nm stacked wafer technology, ensure low power consumption, low noise, and optimized die area. Compared with existing VGA sensors, the chip has a 75% increase in the number of pixels and a smaller chip area.