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Diodes Introduces Space-Saving Schottky Rectifier, Setting New Paradigm for Current Density

May 8 2022 2022-05 Power Diodes Incorporated
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Diodes Corp. announced the launch of a line of high-current Schottky rectifiers in ultra-small chip level packages (CSP), SDM5U45EP3 (5A, 45V), SDM4A40EP3 (4A, 40V) and SDT4U40EP3 (4A, 40V) reach the highest current density of the same level in the industry, meeting the market demand for smaller and higher power electronic systems.

     Diodes Corporation announces a series of high-current Schottky rectifiers in ultra-small chip-scale packages (CSPs), the SDM5U45EP3 (5A, 45V), SDM4A40EP3 (4A, 40V) and SDT4U40EP3 (4A, 40V) reaching the same class in the industry The highest current density meets the market demand for smaller, higher power electronic systems.

     Each device is suitable for a variety of applications as blocking or reverse polarity protection diodes, electrical overvoltage protection diodes, and freewheeling diodes. This series of rectifiers is designed for space-constrained product applications such as portable, mobile and wearable devices, as well as IoT hardware.

     The top-of-the-line SDT4U40EP3 is the industry's smallest 4A trench Schottky rectifier in an unprecedented 1608 package size. Save 90% of PCB area compared to other brands. With a current density of 800A/cm2, it is an industry leader in trench Schottky products, thanks to a patent-pending innovative cathode design and process. The resulting ultra-low forward voltage performance (0.47V typical) minimizes power losses and enables more efficient system designs. In addition, excellent avalanche capability ensures robustness under extreme operating conditions such as transient voltages.

     The SDM5U45EP3 in the X3-TSN1616-2 package measures 2mm2, while the SDM4A40EP3 and SDT4U40EP3 in the X3-TSN1608-2 package measure 1.28mm2, enabling system designers to achieve maximum maximum size in modern, highly integrated consumer products board space available. These ultra-thin CSP packages measure 0.25mm (typ) and feature shorter thermal paths for better power dissipation, lower thermal BOM cost, and improved reliability.

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