Coeur High Current Interconnect System

     Molex's Coeur high-current interconnect systems deliver up to 200 A through three diameter sizes (3.4 mm, 6 mm, and 8 mm) and are available in a variety of configurations, connecting PCBs, busbars, and cables. When mating two rigid PCBs or busbars, it can be difficult to perfectly align the pins and sockets. A certain amount of float is required in these cases to accommodate any offset that may exist. Coeur high current interconnect systems offer up to 1 mm of float (industry leading) in all three sizes. This flexibility facilitates mating and also prevents potential damage to the socket contacts.

     Compact electronic packages require low height and small bumps above the mating PCB or busbars, or both. All three sizes of Coeur's high-current interconnect system have mating heights as low as 5.00 mm. Therefore, there will be no higher protrusions above or below the mated circuit board,

     Power efficiency is critical to cost management for large power-hungry operations such as data centers and similar applications. Coeur high current interconnect systems are designed with multiple contact beams in each socket. This is used to ensure robust electrical performance (low drop).