Amphenol develops high-speed IP interconnect technology

     Amphenol ICC, a global leader in connector Technology, design and manufacturing, and eTopus Technology, a pioneer of ADC/ DSP-based ultra-high speed SerDes for wire applications such as data centers, cloud, edge and 5G base stations, announced the development of 112Gb/s interconnect technology based on their respective products. This combined solution is suitable for, but not limited to, high-speed communications, machine learning (ML), artificial intelligence (AI), and industrial and instrumentation applications. The interconnect uses 112Gb/s four-stage pulse amplitude modulation (PAM4) technology to provide the maximum possible bandwidth in each communication channel.

     David Jiang, Amphenol ExaMAX and ExaMEZZ Product Manager, said, "ExaMAX2 has proven to be a reliable solution for 112G speed applications in many designs. We are very excited to partner with eTopus and present this end-to-end demonstration to our customers." All selected ExaMAX2 parts can be mass-produced. We are very proud that Amphenol is the first company to be able to offer multiple production-ready 112G high-speed backplane connector solutions based on customer performance and cost requirements."

     "We are excited to partner with an industry interconnect leader like Amphenol and validate their ExaMax2 connector and 1-meter copper cable with our 112Gb/s SerDes IP." This end-to-end demonstration provides a clear upgrade path for modular platforms, allowing them to double the cable cassette width from 12.8Tb/s to 25.6Tb/s with existing electrical signals and their chassis dimensions, "said Harry Chan, CEO of eTopus. "When using the new Amphenol connector and our latest 112G ePHY SerDes, we are very pleased with the low bit error rate without channel impairment concerns. Robust and reliable connections are essential for the widespread deployment of 112G copper connections."