AVIC launched 7mm low-pitch high-current parallel board connectors

     With the development of 5G communication technology, the size of the equipment is getting smaller and smaller, and the connector is also developing in the direction of miniaturization and high flow density. For the application scenario of transmission between parallel printed boards, the lower spacing can greatly save the internal space of the user equipment. In order to realize the large current and signal transmission between the ultra-low spacing parallel boards inside the communication equipment, AVIC Optoelectronics launched a 7mm low spacing high current parallel board. board-to-board connector.

Features

 ● Support high power and signal transmission between ultra-low pitch boards of 6.7~7.5mm, which can significantly reduce the thickness and volume of the equipment;

● Product serialization, the maximum current of a single pin can reach 70A, and through flexible combination selection, it can cover low-frequency signals to current transmission as high as 200A;

● Small footprint and high flow density;

● The plug comes with a dust cover, which is convenient for the PCB as a whole to do three-proof treatment. The dust cover can also be used as a crimping tool, and the user does not need to design a tool;

● The termination method is free-soldering and crimping, and the material can withstand high temperature reflow soldering and is not affected by other component soldering processes.

     This product is suitable for low-frequency signal and power transmission between the main printed board and parallel daughter boards, and is mainly used in communications, data transmission, servers and other fields.