Records 5,530
Page 89/461

Infineon XENSIV Networked Sensor Suite
2023-04
Semiconductors
Infineon Technologies
[Apr 24 2023] Infineon's XENSIV™ KIT CSK PASCO2 and XENSIV™ KIT CSK BGT60TR13C Networked Sensor Kit (CSK). The XENSIV™ Connected Sensor Suite provides a ready-available sensor development platform for Internet of Things (IoT) devices that can be used to create innovative prototypes based on Infineon sensors, including radar, environmental sensors, and more.The two XENSIV Networked sensor kits include the XENSI ...

Vishay introduces an updated infrared receiver that reduces the power current
2023-04
Semiconductors
Vishay
[Apr 24 2023] Vishay Intertechnology has announced the upgrade of the TSOP2xxx, TSOP4xxx, TSOP57xxx, TSOP6xxx and TSOP77xxx series of infrared (IR) receiver modules with the new generation Cyllene 2 IC. The new IC is designed to ensure long-term supply and shorter lead times, helping designers significantly reduce supply currents over a wider range of supply voltages, while improving reliability against ESD an ...

Vishay introduces a new line of automotive grade surface mount standard rectifiers
2023-04
Semiconductors
Vishay
[Apr 24 2023] Vishay Intertechnology has announced the launch of three new lines of automotive surface mount standard rectifiers --2 A SE20Nx, 3 A SE30Nx and 4 A SE40Nx -- in the industry's most advanced thin wet-able wing DFN3820A package. With reverse voltages of 200 V, 400 V and 600 V, respectively, SE20Nx, SE30Nx and SE40Nx provide a space-saving and efficient solution for power line polarity protection an ...

Quick-Connect Studio is the first cloud-based system development tool for dynamic software development
2023-04
Semiconductors
Renesas Electronics America
[Apr 24 2023] Renesas Electronics announced the launch of Quick-Connect Studio, a new cloud-based design platform for groundbreaking online Internet of Things systems that enables users to build hardware and software graphically to quickly validate prototypes and accelerate product development. The current software development process is cumbersome -- engineers need to research and define projects, gather equi ...

Qualcomm expands its portfolio to simplify and accelerate the development of iot across multiple industries
2023-04
Power
Qualcomm
[Apr 21 2023] Today, ecosystem fragmentation and system design complexity often result in iot deployments not reaching their full potential. By combining an industry-leading chip and extensive ecosystem of hardware and software partners with a developer-friendly cloud architecture, the Qualcomm Aware platform will provide a differentiated suite of services for managing assets that require critical, accurate, a ...

Micson Semiconductor unveils new AMR geomagnetic sensor
2023-04
Semiconductors
Micron Technology Inc.
[Apr 21 2023] Micron Semiconductor announced the new AMR geomagnetic sensor MMC5616WA, a new upgrade of Micron's large-scale production of ultra-small size AMR geomagnetic sensor MMC56x3 series, to meet the rich application scenarios including smart phones, wearable devices, drones, AR/VR. As the navigation function of portable devices such as smart phones is used more frequently, users have higher requirement ...

Advantech launches AIMB-278 Industrial motherboard
2023-04
Sensors
Advantech Corp
[Apr 21 2023] Advantech launches AIMB-278 Industrial motherboard. AIMB-278 is powered by a 12/13th-generation Intel Core processor that leverages DDR5 and PCIe x16 Gen 5 to deliver outstanding throughput. At the same time, it supports expansion of the M.2 M key and M.2 E key, as well as rich I/O (6 x USB 3.2 Gen 2, independent 4 display, up to 4K support), enhanced mass data transfer and image processing capab ...

TDK introduces the industry's highest rated current laminated magnetic bead for on-board power lines
2023-04
Semiconductors
TDK
[Apr 21 2023] TDK has announced the launch of the new MPZ2520SPH series of laminated magnetic beads for on-board power lines. With a rated current of 12 amps and a size of 2.5 x 2.0 x 0.85 mm (L x W x H), this series of patch magnetic beads is not only the highest rated current in the industry, but also very compact and compact in structure. The series of magnetic beads began mass production in February 2023. ...

STMicroelectronics Integrated flyback controller with advanced features
2023-04
Semiconductors
STMicroelectronics
[Apr 21 2023] STMicroelectronics HVLED101 flyback controller is suitable for LED lamps up to 180W. It integrates various functions, control patented technology and primary detection voltage regulator support to help improve lighting performance and simplify lamp circuit design. The HVLED101 comes in a narrow-shape SO-14N package. The controller provides all the necessary built-in protection functions, includin ...

TDK expands its TronicsAxo300 lineup with the introduction of two high-performance digital MEMS accelerometers
2023-04
Semiconductors
TDK
[Apr 21 2023] TDK Corporation has expanded its fixed-speed AXO300 accelerometer lineup with the introduction of AXO301 and AXO305. Following the successful launch in 2020 of the ± 14g AXO315 accelerometer for high-performance navigation and dynamic system positioning applications, Constant Speed has expanded its AXO300 accelerometer lineup with the AXO301 and AXO305. AXO301 is a low-noise, high-resolution ±1 g ...

Diodes produce intelligent high-side switchers
2023-04
Power
Diodes Incorporated
[Apr 21 2023] Diodes announced the launch of the DIODES ZXMS81045SPQ, its first self-protective, automotive compliant high-side IntelliFET™ product. This small size device provides high power, protection and diagnostic functions and is suitable for driving 12V vehicle installation loads such as leds, bulbs, actuators and motors in automotive body control and lighting systems. ZXMS81045SPQ provides an efficient ...

Canon introduces new wafer measuring machine to improve the production efficiency of semiconductor lithography equipment
2023-04
Power
Canon
[Apr 21 2023] Canon has introduced MS-001, a wafer measuring machine used in semiconductor manufacturing, which can measure wafers with high precision. As the manufacturing process of advanced semiconductors such as logic and memory becomes more complex, wafers are more prone to warp and deformation. In order to produce high-precision semiconductor components, the deformation of the wafer needs to be accuratel ...