Technology Articles

2024-01 Passive Components Littelfuse

[Jan 26 2024] The company launched TTape, a breakthrough overtemperature detection platform to improve the management of lithium-ion battery systems. With its innovative features and unparalleled advantages, TTape helps automotive systems effectively control premature battery aging while reducing the risks associated with thermal runaway accidents. TTape is ideal for a wide range of applications, including ele ...

2024-01 Connectors STMicroelectronics

[Jan 26 2024] STMicroelectronics' EVLSPIN32G4-ACT Edge AI Motor driver reference design is based on the STSPIN32G4 intelligent three-phase motor driver, which reduces the development difficulty of intelligent actuators. St's wireless industrial sensor node, the STWIN.box(STEVAL-STWINBX1), integrates motor control, real-time analysis of environmental data and iot connectivity. These two circuit boards can be di ...

2024-01 Sensors STMicroelectronics

[Jan 25 2024] STMicroelectronics and Sphere Entertainment, Inc. have announced the latest details of the world's largest image sensor developed for Sphere's Big Sky photography system. Big Sky is a breakthrough ultra high resolution professional photography system used to capture images for Sphere, the next generation entertainment media company in Las Vegas. Sphere has installed the world's largest high-resol ...

2024-01 Optoelectronics Connect One LTD.

[Jan 24 2024] As the number of applications for 3D cameras continues to increase, the demand for sensor technology is also growing rapidly - users want professionally configured sensors that can be adapted to a variety of applications and optimized for performance and cost. To meet the growing demand, Coherent now offers a lattice projector module based on a 940 nm vertical cavity surface emitting laser (VCSEL ...

2024-01 Passive Components Vishay

[Jan 24 2024] Vishay Intertechnology has announced the availability of upgraded TSOP18xx, TSOP58xx and TSSP5xx series infrared (IR) receiver modules for remote control, proximity detection and light screen applications. Packaged in Minicast, the enhanced solution provides plug-play replacement for existing family devices, with 50% lower supply current, up to 12 kV ESD resistance, 2.0V to 5.5V supply voltage, 2 ...

2024-01 Sensors TDK

[Jan 23 2024] TDK Corporation is pleased to introduce the demo kit for the mechanically decoupled ultrasonic sensor module USSM1.0 PLUS-FS. It is ideal for obstacle detection and distance measurement applications under harsh conditions, such as bright light and transparent object detection, and is widely used in autonomous mobile robots (AMR) or autonomous guided vehicles (AGV). The demo kit includes a TDK dem ...

2024-01 Connectors Infineon Technologies

[Jan 23 2024] Modern power systems require efficient and compact regulators. To address this challenge, Infineon Technologies AG has launched the TDA388xx family for the server, AI, data communications, telecommunications and storage markets. The latest 12 A and 20 A synchronous step-down regulators use a fast constant on-time (COT) control mode to optimize performance. This approach ensures fast transient res ...

2024-01 Sensors Melexis Technologies NV

[Jan 22 2024] Melexis has announced the launch of the MLX90830, the first pressure sensor chip using the newly patented Triphibian technology. This MEMS pressure sensor is designed in unprecedented miniaturization to robustly measure pressure in gas and liquid media from 2 to 70bar. The device is factory-calibrated by Melexis to measure absolute pressure and provide a proportional analog output signal. The MLX ...

2024-01 Power Renesas Electronics America

[Jan 22 2024] Renesas Electronics announced the launch of the DA14592 Bluetooth Low Energy (LE) system-on-chip (SoC), Renesas' lowest power consumption and smallest multi-core (Cortex-M33, Cortex-M0+) Bluetooth Low energy product. Thanks to the careful trade-off between on-chip memory (RAM/ROM/ flash) and SoC chip size (which determines cost), the DA14592 is well suited for a wide range of applications includi ...

2024-01 Connectors Transphorm

[Jan 19 2024] Transphorm has announced two new SuperGaN devices in the 4-pin TO-247 package (TO-247-4L). The newly released TP65H035G4YS and TP65H050G4YS FET devices have 35 milliohm and 50 milliohm on-resistance, respectively, and are equipped with a Kelvin source extreme to provide customers with more comprehensive switching capabilities with lower energy losses. The new products will use Transphorm's proven ...

2024-01 Connectors Microchip Technology

[Jan 19 2024] Microchip Technology has announced the introduction of its next-generation LAN969x Ethernet switching chip. The series features time-sensitive networking (TSN), scalable bandwidth from 46 Gbps to 102 Gbps, and a powerful 1 GHz single-core Arm® Cortex®-A53 CPU. For applications requiring greater redundancy, the LAN969x series Ethernet switching chips can be configured with High Availability Seamle ...

2024-01 Passive Components TDK

[Jan 18 2024] TDK Corporation introduces the latest inductor series KLZ2012-A with dimensions of 2.0mm (L)x 1.25mm (W)x 1.25mm (H). Designed to meet the needs of automotive audio bus (A2B) applications, this series of stacked inductors offers a wide operating range, high durability and excellent inductance tolerances. The series will begin mass production this month, in January 2024. The new low-resistance sof ...