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Improve artificial intelligence with cutting-edge HBM4 technology
2025-01
Semiconductors
Adafruit Industries
[Jan 6 2025] Artificial intelligence (AI) and machine learning (ML) are advancing at an extraordinary pace, powering progress across industries. As models become larger and more complex, they need to process large amounts of data in real time. This demand puts pressure on the underlying hardware infrastructure, especially memory, which must process massive data sets quickly and efficiently. High-bandwidth mem ...

Laird Thermal Systems announces the launch of a new line of micro-thermoelectric chillers for next-generation optoelectronic devices
2025-01
Connectors
Laird Technologies
[Jan 4 2025] Laird Thermal Systems announced the expansion of its product line of micro-thermoelectric chillers with the introduction of the OptoTEC™ MBX family for space-constrained, high-performance optoelectronics applications. The MBX series uses next-generation thermoelectric materials and advanced automated processes TO provide standard and custom options for TEC used in applications such as To-CAN, TOS ...

Samsung foundry unreliable, their flagship processor Exynos may be transferred to TSMC
2025-01
Semiconductors
Samsung
[Jan 4 2025] According to reports, due to the unsatisfactory performance of Samsung's foundry business, coupled with weak market demand, Samsung has decided to further close some of the previous generation of production lines. It is particularly noteworthy that even its most advanced second-generation 3-nanometer 3GAP process technology has only reached a low yield of 20% (reference reading: TSMC! Samsung sec ...

Second generation DDR5 MRDIMM complete memory interface chipset solution for server
2025-01
Connectors
Renesas Electronics America Inc.
[Jan 4 2025] Renesas Electronics, a global semiconductor solutions provider, announced the first full memory interface chipset solution for the second-generation DDR5 multi-capacity dual-in-line memory module (MRDIMM). Increasing memory bandwidth requirements for artificial intelligence (AI), high performance computing (HPC), and other data center applications require new DDR5 MRDIMMs. They operate at speeds ...

Silicon Labs is the first to support Matter 1.4 to take the smart home to the next level
2025-01
Optoelectronics
Silicon Labs
[Jan 4 2025] The Connectivity Standard Alliance (CSA) has released version 1.4 of the Matter 1.4 standard. As a key member of the Connectivity Standards Consortium, and a longtime supporter and active promoter of the Matter standard, Silicon Labs is providing comprehensive solutions that include wireless hardware, software, tools, and the newly launched Matter Extension suite. It was the first to implement su ...

What Is a TL072CD Amplifier?
2025-01
Semiconductors
STMicroelectronics
[Jan 3 2025] What Is TL072CD? The TL072CD is a practical and efficient dual operational amplifier that combines high-performance JFET and bipolar transistor technology into a single chip, making it both powerful and reliable. It boasts fast response speeds, low bias and offset currents, and minimal temperature influence on offset voltage. Simply put, this chip not only performs quickly but also remains except ...

ON Semiconductor launches industry-leading analog and mixed-signal platforms
2025-01
Semiconductors
ON Semiconductor
[Jan 3 2025] Onsemi announced the launch of the Treo platform, an analog and mixed-signal platform built with advanced 65nm node BCD (Bipolar - CMOS-DMOS) process technology. The platform provides a strong foundation for ON's broad range of power and perception solutions, including high performance and low power perception, efficient power management and dedicated communications devices. With this scalable si ...

Onsemi and Wurth Electronics collaborate to upgrade virtual design for high-precision power electronics applications
2025-01
Semiconductors
ON Semiconductor
[Jan 3 2025] Onsemi and Wurth Elektronik announced that Wurth's passive component database has been integrated into ON's unique PLECS® Model Self Generation Tool (SSPMG). SSPMG is a web-based platform with an intuitive, easy-to-use interface that enables engineers to customize high-precision, high-fidelity PLECS models for complex power electronics applications to identify and fix performance bottlenecks earl ...

Panasonic Automotive Electronics Systems joins hands with Arm to advance software-defined automotive standardization
2025-01
Semiconductors
Panasonic
[Jan 3 2025] Panasonic Automotive Electronics Systems (PAS) and Arm announced a strategic collaboration to advance the standardization of software-defined vehicle (SDV) architectures. Based on a shared vision, the two companies are committed to creating a flexible software stack that meets the needs of current and future vehicles, and have promoted standardization cooperation in software development for the a ...

Tektronix introduces breakthrough power measuring instruments
2025-01
Connectors
Tecate Group
[Jan 3 2025] Tektronix has officially launched its latest series of isolated current probes (TICP ISO V) as well as a three-channel bidirectional power supply (EAPSB 20,000). These two new products not only set a new benchmark in the field of power test and measurement, but also demonstrate Tektronix's outstanding strength in driving technological innovation in the industry. Tektronix's new products focus on ...

Frontiers of Artificial Intelligence - The top trends affecting Engineering in 2025
2025-01
Semiconductors
Weidmuller
[Jan 2 2025] Ai is playing a key role in reshaping the engineering paradigm, providing tools and methods that improve precision, efficiency, and adaptability in various fields. Engineering leaders who want to stay ahead in the AI race should focus on advances in four key areas: generative AI, verification and validation, reduced order model (ROM), and control system design. Trend 1: GenAI moves to block diagr ...

Highly integrated solutions for vehicle information services and remote connectivity systems
2025-01
Semiconductors
NXP
[Jan 2 2025] From GPS navigation to infotainment systems and wireless connectivity, in-vehicle telematics capabilities have become an integral part of our driving experience, propelling us forward like engines and wheels. The rapid development of chip and software technology is an important driving force for this change in automotive applications. Today's cars have evolved into intelligent, interconnected sof ...