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Molex introduces MediSpec Medical Plastic Circular (MPC) interconnect system
2015-02
Connectors
Molex
[Feb 25 2015] Molex introduces the MediSpec Medical Plastic Circular (MPC) interconnect system, a cost-effective, customized, off-the-shelf interconnect with extremely high insertion and withdrawal times and low insertion and withdrawal forces at a fraction of the cost of competing turning contact systems. MediSpec MPC interconnect systems offer both superior performance and ease of use, combining proven, cost ...

Xilinx continues to lead at 16nm with new memory, 3D-on-3D and multiprocessing SoC technologies
2015-02
Connectors
Xilinx
[Feb 24 2015] Xilinx Corporation, a global leader in All Programmable technologies and devices, announced that its 16nm UltraScale+ family of FPGas, 3D ics and MPsoCs has once again achieved a first-generation value advantage with new memory, 3D-on-3D and multi-processing SoC(MPSoC) technologies. For even higher performance and integration, the UltraScale+ series also features a new connectivity optimization t ...

ST's flexible and convenient STMCube software platform helps designers get started quickly
2015-02
Connectors
STMicroelectronics
[Feb 23 2015] Experience the speed and convenience of STMCube software development on STMicroelectronics STM32 microcontrollers. The STMCube development tool is available to support all current production STM32 microcontrollers. The STM32Cube makes it easier for designers to get started, thereby speeding up STM32 microcontroller application development and simplifying cross-system code migration. From ultra-lo ...

Atmel introduces the next generation of radiation-resistant mixed-signal ASics for aerospace applications
2015-02
Connectors
Artesyn Embedded Technologies
[Feb 22 2015] Atmel, the global leader in microcontrollers and touch solutions, has announced the next generation of radiation-resistant (rad-hard) mixed-signal application-specific integrated circuit (ASIC) platforms that deliver high density solutions with superior functionality for aerospace applications. The ATMX150RHA, manufactured using a 150nm process based on insulated silicon (SOI), further expands At ...

The DiodesLED driver provides Type E transformer high compatibility for non-dimmable MR16 lamp designs
2015-02
Connectors
Diodes Incorporated
[Feb 22 2015] Diodes Incorporated introduces the AL8820 LED Driver Converter. The new product is a compact two-stage step-up and step-down non-dimmable MR16 lamp design solution with high power factor, low total harmonic distortion and low output current ripple. In the case of the 6W MR16 application, the device can be paired with most general-purpose LED lamp transformers to support flicker-free operation at ...

The AMS color sensor improves mobile device accuracy and analyzes the type of light source
2015-02
Sensors
ams
[Feb 21 2015] Ams, a leading supplier of high-performance analog ics and sensors, introduces the TCS3490 color sensor designed for portable devices with light source type sensing that is ideal for devices operating under different light sources. The TCS3490 smart color sensor can accurately measure color and light intensity, enabling designers to achieve more refined display management and brightness control f ...

Microsemi enhances SmartFusion2 SoC FPgas and IGLOO2 FPgas with physically unclonable capabilities
2015-02
Connectors
Microsemi
[Feb 21 2015] Microsemi Corporation, a leading provider of differentiated semiconductor technology solutions in terms of power, safety, reliability and performance, has announced its flagship SmartFusion 2 SoC FPGas and IGLOO 2 FPGas The device's portfolio of leading network security features joins Intrinsic-ID, B.V licensed Physically Unclonable Function (PUF). Intrinsic-id is a world leader in secure IP core ...

ST expands its silicon carbide MOSFET portfolio to bring wide-gap technology benefits to more applications
2015-02
Connectors
STMicroelectronics
[Feb 20 2015] STMicroelectronics introduces the new SCT20N120 silicon Carbide power MOSFET transistor, whose advanced energy efficiency and superior reliability will bring technological advantages to more energy-efficient applications, including inverters for pure electric and hybrid vehicles, solar or wind power generation, energy-efficient drives, power supplies and smart grid devices. St is one of the indus ...

Synopsys' new DesignWare Medium Capacity non-volatile memory (NVM) IP reduces chip costs by up to 25%
2015-02
Power
Skyworks Solutions
[Feb 19 2015] Synopsys, a leading global provider of software, intellectual property (IP) and services to accelerate innovation in chips and electronic systems, announced the availability of its new DesignWare Medium Capacity non-volatile memory (NVM)IP products. Medium Density NVM IP fills the gap between low-capacity NVM and high-capacity flash memory without additional masks or process steps, reducing chip ...
ST introduces the STM32F3 microcontroller with a flash capacity of up to 512KB, significantly improving system integration
2015-02
Connectors
STMicroelectronics
[Feb 18 2015] STMicroelectronics' STM32F3 series of microcontrollers is a new addition to meet market demands for high performance, innovative features and affordability. The new microcontroller's on-chip storage capacity is increased to 512KB of Flash memory (Flash) and 80KB of static random access memory (SRAM), and it integrates a wealth of peripheral interfaces, including a motor high speed controller and ...

CSRmesh Home Automation solutions provide easy, seamless control and connectivity for your home environment
2015-02
Power
CTS
[Feb 17 2015] CSR Corporation announced the introduction of CSRmesh Home Automation, an updated version of CSRmesh™, a disruptive Bluetooth® Smart solution. CSRmesh home automation solutions are suitable for a wide range of applications, including the control of heating, ventilation, air conditioning, door locks and window sensors. CSRmesh now enables countless Bluetooth Smart sensors and actuators to easily c ...

Infineon joins hands with Hella to create a safe rear blind 24GHz radar driver assistance system for mid - to low-end models
2015-02
Connectors
Infineon Technologies
[Feb 16 2015] Infineon Technologies AG and German auto parts supplier Hella Group have developed an innovative RF component for radar sensors that effectively monitors blind spots (blind spot detection) in the rear of a vehicle. The module integrates several previously separate components into a single transceiver (with both transceiver functions), saving space and cost, as well as providing better performance ...