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Diodes introduces high-efficiency single-winding inductance 500V step-down LED drivers
2016-01
Connectors
Diodes Incorporated
[Jan 29 2016] Diodes Incorporated introduces the AL1678 series of LED drivers suitable for driving non-dimming LED modified bulbs in general lighting products that do not require a power factor higher than 0.7. These 500V buck converter LED drivers deliver up to 15W of output power across all bus voltages for A variety of LED lighting applications such as A/B/P lamps and GU10 lamps, reducing total circuit mate ...

Molex supplies medical grade surgical cables that meet ISO 13485 requirements using Class 100,000 clean room facilities
2016-01
Power
Molex
[Jan 29 2016] Molex now operates clean rooms that are fully ISO 146441-1:1999 certified, meeting the strictly specified levels of particulate contamination required by ISO. With fewer than 100,000 (30.5mm) particles per cubic foot of air, the Thailand-based facility manufactures a wide range of ISO 13485-compliant medical and surgical cables for use in operating rooms, hospitals, laboratories and clinics. Its ...

Microsemi Corporation offers the first device in a new family of intelligent inductive sensor interface ics
2016-01
Sensors
Microsemi
[Jan 28 2016] Microsemi Corporation announced the introduction of the LX3301A, the first device in a new family of sensor interface integrated circuits (ics) based on inductive sensing technology, which is the first induction sensor IC on the market to utilize a linear variable differential transformer (LVDT) architecture on a printed circuit board (PCB). Designed for automotive and industrial market range app ...

Silicon Labs introduces the industry's smallest energy-efficient touch-sensitive microcontroller
2016-01
Connectors
Silicon Labs
[Jan 28 2016] Silicon Labs has announced the latest addition to its EFM8 8-bit MCU portfolio, designed to meet the demand for ultra-low power consumption, small size packages, and capacitive touch sensing in IoT applications. The new EFM8SB1 Sleepy Bee MCU is the industry's smallest MCU and supports a 1.78mm×1.66mm wafer-level chip size package (WLCSP), a quarter of the traditional 8-bit MCUQFN package size. T ...

Microsemi Corporation's new RF module speeds time to market for implantable medical device designers
2016-01
Connectors
Microsemi
[Jan 27 2016] Microsemi Corporation has announced the availability of the smallest radio module the company has ever produced. Measuring just 5.5mm x 4.5mm x 1.5mm, the ZL70323 is optimized for implantable medical devices such as pacemakers, cardiac defibrillators and neurostimulators. The new radio module replaces the company's ZL70321 device and works with the ZL70120 radio module for external device control ...

Molex develops MXP120 sealed connector systems for automotive applications
2016-01
Power
Molex
[Jan 27 2016] Molex has developed the MXP120 sealed connector system for powertrain, body electronics and safety electronics applications. Connectors and sockets for safety applications come in a distinctive yellow casing, while non-safety-related powertrain and body electronics applications come in a black casing. The 1.20 mm MXP120 sealed connector system with 4.00 mm pitch provides excellent plug, plug and ...

Microchip expands the 32-bit PIC32MX1/2 microcontroller family
2016-01
Connectors
Microchip Technology
[Jan 27 2016] Microchip Technology announced a new family of 32-bit PIC32MX1/2 microcontrollers (MCUS) featuring 256 KB of high-capacity flash memory configuration and 16 KB of RAM in a compact package. As a popular addition to the MCU family, the new device provides flexibility for low-cost applications that require complex algorithms and application code. Works with Microchip's comprehensive range of softwar ...

Cypress introduces the world's lowest-power energy harvesting power management IC for battery-free wireless sensor nodes
2016-01
Semiconductors
Cypress Semiconductor
[Jan 27 2016] Cypress Semiconductor Corporation has announced a new line of energy-harvesting power management integrated circuits (PMIC) for tiny, solar-powered wireless sensors in the Internet of Things (IoT). With the lowest power consumption in the world, the new device is a single-chip energy harvesting PMIC that can use solar panels with an area of only 1 cm2. The new PMIC devices are ideal for battery-f ...

Diodes Ultra-high speed rectifiers provide 600V 8A performance for power factor correction applications
2016-01
Passive Components
Diodes Incorporated
[Jan 26 2016] Diodes Incorporated's new 600V 8A ultra-high speed rectifier, the DSR8F600, is specially designed for use in boost diodes with power factor correction and continuous on-mode. The target market is to provide switching power supplies with high output of over 75W in end devices such as flat panel TVS, servers and telecommunications systems to meet new and higher energy efficiency standards in Europe ...

Silicon Labs simplifies Bluetooth Smart design with fully integrated Blue Gecko modules
2016-01
Power
Silicon Labs
[Jan 26 2016] Silicon Labs, a leading provider of wireless connectivity solutions for the Internet of Things (IoT), announced the launch of a fully integrated, pre-certified Bluetooth Smart module solution that provides developers with the easiest way to implement low-power wireless connectivity for IoT. The new BGM111 module is the first in Silicon Labs' advanced Blue Gecko module family, offering optimal int ...

Cypress introduces new products for the industry's fastest HyperFlash NOR flash memory
2016-01
Semiconductors
Cypress Semiconductor
[Jan 25 2016] Cypress Semiconductor Corporation announced the launch of a 256Mb NOR HyperFlash product. The 3.0V S26KL256S HyperFlash is the latest flash memory in the industry to support the high-bandwidth, low-pin HyperBus interface. The device is ideal for high-performance applications, such as automotive dashboards, industrial automation, communication systems, and medical devices that require the highest ...

EPC Power Conversion Corporation (EPC) introduces the ideal device for Class D audio amplifiers
2016-01
Power
EPC
[Jan 24 2016] EPC2106, a single-chip half-bridge enhanced gallium nitride transistor, has been announced by EPC2106. By integrating two eGaN® power field effect transistors into one integrated circuit, mutual inductance and the required gap space between the devices on the PCB can be removed, thereby increasing efficiency (especially at higher frequencies) and increasing power density while reducing the assemb ...