Technology Articles

2020-02 Semiconductors NXP

[Feb 4 2020] NXP Semiconductors N.V. introduced a new generation of automotive position sensor KMA210. The KMA210 integrates NXP's latest magnetoresistive sensor chips and a unique signal conditioning ASIC circuit based on NXP's advanced insulated silicon (SOI) ABCD9 process. The KMA210 is the first member of a new family of magnetic sensors and is a complete system-level package solution that requires no ext ...

2020-02 Semiconductors Murata

[Feb 3 2020] Murata has commercialized the KCM series of multi-layer ceramic capacitors with metal terminals for automotive applications and the KRM series of multi-layer ceramic capacitors with metal terminals for general applications with temperature compensation C0G characteristics. Our main goal is to use it in places such as LC resonant circuits for wireless power transmission (WPT*1) systems for electri ...

2020-02 Power Qorvo US Inc.

[Feb 2 2020] Qorvo has introduced a new intelligent power control solution, the Qorvo PAC5556 Power Application Controller (PAC), which significantly reduces the energy consumption, size, weight and noise of smart appliances, AC fans and compressors. This new mixed-signal system-level package (SiP) product not only reduces the bill of materials by 35 percent, but also improves the performance, reliability and ...

2020-02 Passive Components TDK

[Feb 2 2020] TDK Corporation introduces the DeltaCap X Black Premium capacitor, a new series of EPCOS MKD capacitors developed specifically for power factor correction (PFC). Voltage ratings range from 440 V AC to 850 V AC, and the internal triangular connection design is ideal for low voltage power factor correction and harmonic filtering applications. Cell capacitors range in capacity from 3 x51μF to 3 x165 ...

2020-02 Power Semtech

[Feb 1 2020] Semtech, a leading provider of analog and mixed-signal semiconductor products and advanced algorithms, announced the introduction of a new LoRa Smart Home device (LLCC68d), expanding LoRa's market from industry-class low power wide area networks (LPWAN) to smart home, community and consumer applications. The transceiver provides low power consumption and wide coverage for Internet of Things (IoT) ...

2020-02 Connectors TE Connectivity

[Feb 1 2020] TE Connectivity, the global leader in innovative connectivity solutions for high-speed computing and networking applications, announced the introduction of a new Sliver jumper connector that features a new standard form factor and supports panel pluggability for the Open Source Computing Project (OCP) NIC 3.0. This new jumper connector further expands the Sliver product family and is suitable for ...

2020-01 Power Renesas Electronics America

[Jan 31 2020] Renesas Electronics has introduced four new 32-bit RX651 microcontrollers (MCUS) in an ultra-small 64-pin BGA and LQFP package. The new product expands Renesas' popular RX651 MCU family with a 64-pin (4.5mm x 4.5mm) BGA package that offers up to 59% less area than the 100-pin LGA; The 64-pin (10mm x 10mm) LQFP has 49% less area than the 100-pin LQFP. This family of MCUS addresses advanced securit ...

2020-01 Connectors Silicon Labs

[Jan 30 2020] Silicon Labs has introduced a new digital-analog hybrid, all-in-one Software-Defined Radio (SDR) tuner for a leading automotive radio solution provider, expanding its portfolio to support all global digital radio standards on a single common platform to meet the growing needs of automotive radio manufacturers. The new Si479x7 device is Silicon Labs' first automotive Radio tuner to support the Dig ...

2020-01 Connectors STMicroelectronics

[Jan 29 2020] STMicroelectronics VIPer26K releases a high-voltage power converter that integrates a 1050V avalanch-resistant N-channel power MOSFET to provide the offline power supply with the advantages of wide voltage input and simple design. In SO-16N package. With extremely high voltage ratings, the VIPer26K MOSFETs achieve similar voltage handling capabilities without the need for traditional vertically s ...

2020-01 Power Toko

[Jan 28 2020] German company Toposens has introduced its new flagship TS3, a 3D ultrasonic sensor for a variety of applications in the autonomous driving systems market that enables reliable target detection and situational awareness. In contrast to conventional ultrasonic sensors, which are usually only able to measure the distance to the nearest object's reflective surface, Toposens' new 3D sensor has a fiel ...

2020-01 Connectors Infineon Technologies

[Jan 27 2020] Infineon has increased the hybrid silicon carbide (SiC) and IGBT power module EasyPACK 2B to 1200V using an advanced neutral-point-clamped ANPC topology. The module is optimized for the optimal point loss of CoolSiC MOSFET and TRENCHSTOP IGBT4 chipsets, respectively, with higher power density and switching frequencies up to 48 kHz for next-generation 1500V PV and energy storage applications. In c ...

2020-01 Power Power Integrations

[Jan 26 2020] Power Integrations has released a new addition to the InnoSwitch™3 family of constant voltage/constant displacement fly-back switching power supply ics. The new IC offers 95% high efficiency over the entire load range and delivers 100 W power output without the use of heat sinks in a closed adapter. This breakthrough performance improvement comes from the in-house development of high-pressure gal ...