Technology Articles

2020-03 Semiconductors NXP

[Mar 30 2020] NXP Semiconductors announced the full availability of its full range of RF Power multi-chip modules (MCM) portfolio to support the development of massive MIMO active antenna systems for 5G base stations. NXP's 5G Airfast solution is more integrated, reducing power amplifier size, shortening design cycles and simplifying manufacturing processes. Paul Hart, senior vice president and general manager ...

2020-03 Power STMicroelectronics

[Mar 30 2020] STMicroelectronics introduces the latest generation of transient Voltage suppression (TVS) diodes with market-leading power density, rated at 600W and transient power up to 1500W in SMB Flat packages. The SMA Flat package, which is only 1.0mm thick, has a rated and transient power of 400W and 600W, respectively. STMicroelectronics' new 1500W SMB Flat package is not only thin, the transient power ...

2020-03 Passive Components Vishay

[Mar 29 2020] Vishay Intertechnology has announced the launch of a new series of 3.0-V reinforced ENYCAP electric double-layer energy storage capacitors, the 235 EDLC-HVR ENYCAP, for energy harvesting and backup power applications in harsh, high-humidity environments. Vishay BCcomponents 235 EDLC-HVR ENYCAP capacitors are the first in the industry to have a service life of 2000 hours at +85 °C and a maximum ra ...

2020-03 Connectors Molex

[Mar 29 2020] Molex introduces the Impact zX2 backplane connector system, which offers industry-leading speed and signal integrity (SI) performance while supporting data rates up to 28 Gbps in a modular design. The system uses Impel's patented ground shielding and footprint technology to enhance SI performance. For customers looking to upgrade their line cards to meet increasing data rate requirements, this ca ...

2020-03 Connectors Harwin Inc.

[Mar 28 2020] Harwin continues to strengthen its portfolio of interconnect solutions for harsh application environments by adding new products to its flagship Datamate Hi-Rel product family. In response to space-constrained RF/wireless designs, each member of the Datamate Coax family includes multiple (linked) coaxial contacts in a compact housing. Because they provide access to multiple coaxial lines through ...

2020-03 Power Trinamic Motion Control GmbH

[Mar 28 2020] Using TMCM-0013-xA to test the phase current of a motor coil, TRINAMIC offers a cost-effective alternative to test and debug setup. Using standard probe clips or SMA-2-BNC connectors, engineers can now find the best current for their motors and applications without the need for expensive current clips. On October 7, TRINAMIC Motion Control Inc. announced the launch of its latest laboratory tool, ...

2020-03 Connectors Diodes Incorporated

[Mar 27 2020] Diodes announced the AL3644, a high-speed dual-channel flash LED driver designed to support advanced camera flash and flashlight functions for the latest smartphones and other portable consumer devices. Key features include independent control of the output current, which can be set through an I2C compatible interface, and the ability to combine two devices (each with a different device identific ...

2020-03 Power Infineon Technologies

[Mar 27 2020] With the development of technologies such as artificial intelligence, augmented reality and the Internet of Things, by 2020, there will be 5 billion people around the world using smart devices to sense their surroundings. Infineon Technologies AG has developed a 60 GHz radar chip that enables a whole new way of human-computer interaction. With an integrated antenna system, it can accurately sense ...

2020-03 Connectors Molex

[Mar 26 2020] Molass announced the launch of the Micro-Latch 2.00mm wire-to-board connector system, which is suitable for customers in the industrial automation, consumer goods and automotive markets. Connector systems are ideal for compact applications that require a high temperature resistant design, meeting a variety of standard requirements while still providing excellent reliability. Unique functional fea ...

2020-03 Power STMicroelectronics

[Mar 26 2020] STMicroelectronics announces next-generation STPay System-on-chip (SoC) payment solutions that leverage state-of-the-art technology to improve unconnected payment performance and protection, reduce power consumption requirements, and significantly improve user experience. The new STPay-Topaz family of solutions can be directly embedded in smart cards, pre-installed payment applications running on ...

2020-03 Passive Components Nexperia

[Mar 25 2020] Nexperia introduces A new high quality, high reliability MJD 3 A and 8 A power automotive bipolar transistor (compliant with AEC-Q101 and consumer/industry standards). The portfolio includes eight components that support both 80 V and 100 V, as well as NPN and PNP types. These general-purpose components in industry-standard sizes now complement Nexperia's existing portfolio of high-performance bi ...

2020-03 Connectors Vishay

[Mar 25 2020] Vishay has introduced three new automotive grade IHLP ultra-thin, high-current inductors - the IHLP-1212AZ-5A, IHLP-1212BZ-A1 and IHLP-1212BZ-5A - that are the smallest of the company's automotive products to date. Vishay Dale IHLP-1212AZ-5A, IHLP-1212BZ-A1 and IHLP-1212BZ-5A inductors are available in 3.3mm x 3.3mm 1212 form factors, saving space for next generation Advanced Driver assistance sy ...