Records 5,527
Page 367/461

Diodes introduces the industry's first DisplayPort 2.0 active switch
2020-10
Power
Diodes Incorporated
[Oct 6 2020] Diodes Incorporated announced the industry's first DisplayPort 2.0 (UHBR10) compatible 4-channel, 2:1 active switch, PI3DPX8121 with a multiplexer and ReDriver. The device joins the company's portfolio of DisplayPort switching and signal conditioning solutions designed to meet the design needs of PCS, monitors, set-top boxes and other AV devices. DisplayPort was developed to provide data transmis ...

Vishay introduces a new series of small snap-on aluminum electrolytic capacitors
2020-10
Passive Components
Vishay
[Oct 5 2020] Vishay Intertechnology has announced the introduction of a new series of small clip-on aluminum electrolytic capacitors, the 257 PRM-SI, to increase the design power density. Vishay BCcomponents 257 PRM-SI series capacitors have a 20% increase in ripple current and a 20% reduction in form factor over previous generation solutions, providing up to 5,000 hours of service life at 85 C. With A ripple ...

Transphorm introduces the fourth-generation GaN platform and SuperGaN Power FETs
2020-10
Semiconductors
Transphorm
[Oct 5 2020] The first JEDEC-certified device in Transphorm's SuperGaN family is the TP65H300G4LSG. This is a 650V GaN FET in a PQFN88 package with an on-resistance of 240 milliohm. The second SuperGaN device is the TP65H035G4WS, also a 650V GaN FET, in a TO-247 package with a 35 milliohm on-resistance. These devices are currently in the sample phase and will be released in the second and third quarters, resp ...

Direct Insight introduces the i.MX8 SoM module
2020-10
Power
DLP Design Inc.
[Oct 4 2020] System integrator Direct Insight has introduced the QS8M welding module, produced by its long-time partner Ka-Ro Electronics Materials based in Aachen, which integrates NXP I.M8M quad-core or dual-core Cortex-A53 64-bit processors, as well as RAM, flash memory and power management. The module features a QFN-style pin arrangement that provides excellent miniaturization, thermal efficiency and EMI ...

Dialog launches SmartBond TINY module to help accelerate IoT development
2020-10
Semiconductors
Dialog Semiconductor GmbH
[Oct 4 2020] Dialog Semiconductor, a supplier of highly integrated power management, charging, AC/DC power conversion, Bluetooth low power, low power Wi-Fi and industrial ics, announced the launch of the DA14531 SmartBond TINY module to help customers develop the next generation of connected devices. The SmartBond TINY module is optimized to significantly reduce the cost of adding Bluetooth low power connecti ...

Diodes introduces its new family of automotive compatible CMOS clock buffers
2020-10
Connectors
Diodes Incorporated
[Oct 3 2020] Diodes Incorporated announced the launch of its new family of automotive compatible clock buffers designed to operate at low power consumption at ambient temperatures up to 105°C, which can be found in applications and automotive gateways in both advanced driver assistance systems (ADAS) and infotainment systems. The increasing maturity of automotive electronics leads to more complex system clock ...

STMicroelectronics' two products target the booming Chinese new energy vehicle market
2020-10
Power
STMicroelectronics
[Oct 3 2020] New energy vehicles are nothing new in China. According to a 2012 academic paper, the government introduced preferential policies for the development of new energy vehicles as early as 1995. In 2015, sales of new energy vehicles in China surpassed those in the United States. In December 2019, the Ministry of Industry and Information Technology predicted that new energy vehicles would account for ...

Diodes introduces USB Model C linear multiplexer/demultiplexer with integrated USB-C detector
2020-10
Connectors
Diodes Incorporated
[Oct 2 2020] Diodes Incorporated announced that PI3EQX10612 / PI3EQX10312 2-port 10Gbps linear ReDriver™ devices feature integrated USB-C® inspection for devices implementing USBType-C® interfaces. ReDrivers offers 1:2/2:1 multiplexer/multiplexer capabilities that can be used to extend the coverage of USB signals running on rigid or flexible PCBS in game consoles, laptops, desktops, tablets, and other consume ...

Micron announces the new Micron 5210 ION enterprise-class SATA SSD
2020-10
Power
Micron Technology Inc.
[Oct 2 2020] Micron Technology, a leading provider of memory and storage solutions, has announced the 5210 ION enterprise-class SATA solid-state Drive (SSD) with new capacity and capabilities, cementing its leadership in QLC technology volume production. As the world's first QLC SSD, the Micron 5210 is based on the company's advanced QLC NAND technology and is rapidly replacing traditional mechanical hard dri ...

Trinamic introduces the world's smallest and lightest servo controller module
2020-10
Connectors
Trinamic Motion Control GmbH
[Oct 1 2020] TRINAMIC Motion Control Ltd. announces the availability of its rugged, high-quality single-axis servo controller module. Designed with 18A RMS and 8... Designed for 28V DC servo drivers with EtherCAT or CAN and RS485 interfaces. The ultra-light aluminum housing in accordance with DIN EN 60529 and advanced feature set make the TMCM-1617 a key enabler for medical, aerospace and robotics technologie ...

Renesas Electronics introduces new 32-bit RX72N and RX66N MCUS
2020-10
Connectors
Renesas Electronics America
[Oct 1 2020] Renesas Electronics, a leading global provider of semiconductor solutions, announced the introduction of new members of the RX product family - the 32-bit RX72N product group and the RX66N product group, with a single chip that integrates device control and network connectivity. The RX72N is based on Renesas' proprietary RXv3 CPU core, with a maximum operating frequency of 240MHz and dual Etherne ...

Vishay introduces ThermaWick THJP series of surface mount thermal jumper chip resistors
2020-09
Passive Components
Vishay
[Sep 30 2020] Vishay Intertechnology has announced the ThermaWick THJP series of surface mount thermal jumper chip resistors. Vishay Dale thin-film devices enable designers to transfer heat from electrical isolation devices to ground layers or general-purpose radiators by providing a heat-conducting channel. Using an aluminum nitride substrate with a thermal conductivity of up to 170 W/mK, the chip reduces the ...