Technology Articles

2020-11 Power Xilinx

[Nov 3 2020] Xilinx, a global leader in adaptive and intelligent computing, announced the Virtex® UltraScale+™ VU23P FPGA, the latest member of the UltraScale+ FPGA product family optimized for networking and storage acceleration, combining multiple resources in a unique way. Delivers more efficient packet processing and scalable data bandwidth for breakthrough performance for networking and storage applicati ...

2020-11 Passive Components Vishay

[Nov 3 2020] Vishay Intertechnology has announced the introduction of new devices with a temperature coefficient (TCR) as low as 2 ppm/K in 0603, 0805 and 1206 form factors, extending its TNPU e3 series of automotive grade high precision thin film flat sheet resistors. The device is suitable for SMT processing in automatic SMD assembly systems using automatic wave soldering, reflow soldering or vapor phase re ...

2020-11 Connectors Infineon Technologies

[Nov 2 2020] Infineon Technologies has developed the world's first fully self-contained Raspberry Pi audio amplifier Hardware expansion Board (HAT). Not only is it compact, but it also delivers high-fidelity audio at speaker power levels. Infineon's proprietary multilevel technology ensures that Raspberry PI users and makers can enjoy minimal product size and power consumption, while maintaining best-in-class ...

2020-11 Sensors STMicroelectronics

[Nov 2 2020] STMicroelectronics further expands its product range of FlightSense™ ToF ranging sensors with the introduction of a new product, the VL53L3CX, based on a patented histogram algorithm. The new product can measure the distance of multiple targets with greater accuracy. The VL53L3CX has a range of 2.5cm to 3m, and unlike traditional infrared sensors, the measurement accuracy is not affected by the c ...

2020-11 Passive Components ams

[Nov 1 2020] At present, the interior design of cars is undergoing drastic changes. The display is getting bigger, the number of manual controls is decreasing, and the custom lighting scheme creates a comfortable interior atmosphere. Advanced driver assistance systems (ADAS) and technologies previously designed for mobile devices, such as facial recognition, eye tracking or gesture sensing, are increasingly b ...

2020-11 Power TE Connectivity

[Nov 1 2020] TE Connectivity, a global technology leader in connectivity and sensing, introduces new NanoRF modules and contacts that are twice as dense as current VITA 67 RF modules for VPX embedded computing applications. It is a high-frequency miniature coaxial cable contact that provides smaller contacts and higher RF contact density via a multi-position module. This design allows for a smaller package, s ...

2020-10 Connectors TE Connectivity

[Oct 31 2020] TE Connectivity, a global technology leader in connectivity and sensing, announced the introduction of a new CeeLok FAS-X connector that combines robust reliability and signal integrity to meet high-speed protocol requirements now and in the future. The connector allows for quick field connection and servicing with only standard terminal insertion/removal and crimping tools. The CeeLok FAS-X conn ...

2020-10 Semiconductors Diodes Incorporated

[Oct 31 2020] Diodes Incorporated announced the launch of the first product in a new generation of discrete MOSFETs. The DMN3012LEG offers greater efficiency in a smaller package, resulting in considerable cost, power and space savings in a variety of power conversion and control applications. Compared to typical two-chip solutions, the DMN3012LEG integrates dual MOSFETs in a single package measuring just 3.3m ...

2020-10 Sensors OmniVision Technologies Inc

[Oct 30 2020] OmniVision Technologies, the world's leading digital imaging solution provider, has announced the automotive industry's first image sensor powered by Nyxel's ground-breaking near-infrared (NIR) technology: the OX03A2S. The 2.5 megapixel ASIL-B class sensor is designed for external imaging applications and can be used in low-light or even no-light environments up to 2 meters around the car body. N ...

2020-10 Sensors TDK

[Oct 30 2020] TDK has introduced the InvenSense ICM-42688-P high-performance motion sensor, a 6-axis MEMS IMU device (MotionTracking) that integrates a 3-axis MEMS gyroscope and a 3-axis MEMS accelerometer in a 2.5mm x 3mm x 0.9mm package. The device supports high-precision motion sensor applications such as robotics, wearables, drones, and other iot devices. Compared to traditional consumer IMUs, the ICM-4268 ...

2020-10 Connectors TE Connectivity

[Oct 29 2020] TE Connectivity, a global technology leader in connectivity and sensing, has introduced its newly developed cost-optimized connector tail cover for DMC-MD single-module connectors. The new connector tail cover is the latest cost-saving addition to TE's existing Deutsch DMC-MD single-module family of products. The DMC-MD connector is one of the most widely used connector types for on-board enterta ...

2020-10 Power Microchip Technology

[Oct 29 2020] With the rise of artificial intelligence, machine learning technologies, and the Internet of Things, applications are beginning to migrate to the edge of the network where data is collected. To reduce volume, reduce heat production, and improve computing performance, these edge applications require energy-efficient solutions. Microchip Technology Inc. 's intelligent embedded vision solution is de ...