Support
sales@oemstron.com
86-755-83232896
English$ USD
Contact Us
TELEPHONE86-755-83232896
E-MAILsales@oemstron.com
SKYPEcondy@oemstron.com
QQ2881672436
MessageLeave Your Message
Top

Technology Articles

Records 5,530
Page 351/461
Article Cover

Harwin extends Archer Kontrol's board-to-board industrial connector

2020-12 Connectors Harwin Inc.
[Dec 24 2020] Harwin expands Archer Kontrol's portfolio of board-to-board industrial connectors to meet cable-to-board connection requirements. Based on customer feedback, Harwin has just launched an off-the-shelf IDC cable assembly option for use with existing discrete connector components. These products can now be purchased directly from stock through Harwin's global network of distributors. All of these co ...
Article Cover

Maxim introduces sensor-based analog ics that provide high-precision measurement solutions for goods and equipment

2020-12 Sensors Maxim Integrated
[Dec 23 2020] Maxim Integrated announced the launch of two industry-leading basic analog ics that provide high-precision, high-reliability solutions for cold chain logistics, including pharmaceuticals, and other temperature monitoring applications. The MAX31889 digital temperature sensor is the perfect combination of high precision and low power consumption to replace expensive resistance temperature detectors ...
Article Cover

STMicroelectronics introduces 150MHz+ high speed radiation hardened logic device

2020-12 Semiconductors STMicroelectronics
[Dec 23 2020] STMicroelectronics launches two of the first products of the high-speed anti-radiation logic product family, enabling aerospace electronic digital circuits to operate at frequencies above 150MHz. The QML-V certified RHFOSC04(SMD 5962F20207) crystal driver/frequency division chip and RHFAHC00(SMD 5962F18202) four-way NAND gate logic chip operate at more than twice the speed of typical radiation-re ...
Article Cover

Micron's independent graphics memory can help Nvidia achieve groundbreaking gaming speeds

2020-12 Semiconductors Micron Technology Inc.
[Dec 23 2020] Micron Technology has unveiled GDDR6X, the world's fastest stand-alone graphics memory solution, leading the way in enabling system bandwidth to reach 1 TB/ SEC. Micron has partnered with graphics computing technology leader NVIDIA to deliver GDDR6X for the first time in new NVIDIA GeForce RTX™ 3090 and GeForce RTX 3080 graphics processors (Gpus) to enable faster speeds for immersive, high-perfor ...
Article Cover

Microchip introduces the industry's only low-inductance SiC power module and programmable gate driver kit

2020-12 Power Microchip Technology
[Dec 22 2020] From trains, trams and trolleybuses to buses, cars and electric vehicle charging points, the global transition to electrification of transport continues to accelerate, with countries adopting more efficient and technologically innovative modes of transport. Microchip Technology announced the AgileSwitchO Digital programmable gate driver and SP6LI SiC power module toolkit. The new toolkit is a uni ...
Article Cover

Pixelworks introduces sixth generation vision processor with AI-adaptive picture quality

2020-12 Power Pi Supply
[Dec 22 2020] Pixelworks has released its sixth generation mobile vision processor, the i6, the first product based on Pixelworks' extensive mobile display dataset and low-power artificial intelligence (AI) technology for training models. The Pixelworks i6 processor is the industry's first device to feature an integrated AI processing unit that adaptively optimizes overall image quality to deliver a consistent ...
Article Cover

TE Connectivity introduces new elbow back covers for cable and optical cable terminations for a variety of aviation applications

2020-12 Passive Components TE Connectivity
[Dec 22 2020] TE Connectivity introduces new elbow back covers for cable and optical cable terminations in a wide range of aviation applications. As the content of aviation systems continues to grow and customers continue to seek greater efficiency, the TE elbow back cover can save designers up to 20% weight. TE elbow back cover is investment cast, so it has a fixed bore and smooth bore. It can be disassembled ...
Article Cover

Melexis introduces multi-channel RGB-LED driver chips

2020-12 Semiconductors Melexis Technologies NV
[Dec 21 2020] Melexis announced the launch of multi-channel RGB-LED driver chip MLX81116. The MLX81116 supports the MeLiBu high-speed communication IP, enabling the concept of intelligent dynamic automotive lighting, which is being used by the world's leading automotive manufacturers to enhance the safety of their latest models. More and more automobile manufacturers want to introduce dynamic lighting into the ...
Article Cover

Vishay extends the TNPW e3 series of high stability thin film flat plate resistors

2020-12 Passive Components Vishay
[Dec 21 2020] Vishay Intertechnology has announced the introduction of a new device in the small 0201 form factor, expanding its TNPW e3 family of automotive grade high stability thin film flat chip resistors. With a temperature coefficient (TCR) as low as 25 ppm/K and a tolerance of only 0.1%, this resistor can be used to improve the accuracy of automotive, industrial, test measurement and medical devices, ex ...
Article Cover

Dialog expands its automotive PMIC portfolio with the latest series of high-current DC-DC buck converters

2020-12 Semiconductors Dialog Semiconductor GmbH
[Dec 21 2020] Dialog Semiconductor Corporation today announced the launch of the DA913X-A product family of high-efficiency, high-current automotive step-down DC-DC (step-down) converters. The highly integrated DA913X-A series devices require fewer external components than competing solutions, enabling lower BOM costs and smaller solution sizes. With an operating efficiency of more than 90%, this family of dev ...
Article Cover

TE Connectivity introduces a new high-density SFP-DD dual-channel I/O interconnect system

2020-12 Connectors TE Connectivity
[Dec 20 2020] TE Connectivity announced the introduction of a small format pluggable dual density (SFP-DD) input/output (I/O) interconnect system to expand its SFP portfolio. The new "dual-density" housing and surface-mount connector break through the traditional single-channel design of the SFP structure to provide dual-channel data transmission to meet the data center's dual-port density requirements and inc ...
Article Cover

Vicor's new power module PI3740 is used in unmanned logistics vehicles

2020-12 Connectors Vicor
[Dec 20 2020] With the development of 5G communication technology and the Internet of Things, driverless technology has become increasingly mature, promoting deep changes in the logistics industry. In the current global epidemic of the new coronavirus, unmanned logistics vehicles have become the focus of attention, and the demand for contactless distribution needs to be solved urgently in the three major appli ...