Technology Articles

2021-02 Power STMicroelectronics

[Feb 13 2021] STMicroelectronics has announced further product details for its innovative Stellar family of automotive microcontrollers, explaining how the new microcontrollers ensure the operational reliability and certainty of multiple independent real-time applications, one of the most critical challenges facing the automotive industry today. The complexity of the new automotive architecture requires the co ...

2021-02 Sensors Verivolt LLC

[Feb 12 2021] Powered by LineVision, Velodyne's Puck sensors provide utility customers with previously unavailable visibility into the health of their assets for optimal management. This situational awareness capability assists utilities by identifying operational anomalies, helping to reduce incidents that could cause wildfires or damage. Power lines equipped with LineVision monitoring are safer and more reli ...

2021-02 Semiconductors Dialog Semiconductor GmbH

[Feb 12 2021] Dialog Semiconductor, a leading provider of battery and power management, Wi-Fi, Bluetooth Low Energy (BLE), industrial IoT solutions, announced that its DA7280 HD haptic control driver IC has been certified to automotive grade. The IC has been selected by Alps Alpine, a leading manufacturer of automotive electronic components and in-vehicle information equipment, to be used in conjunction with t ...

2021-02 Sensors Maxim Integrated

[Feb 11 2021] Maxim Integrated Products announced the launch of the Health Sensor Platform 3.0 (HSP 3.0), reducing development time by at least six months. The wearable wrist reference design is MAXREFDES104 and is used to monitor blood oxygen (SpO2), electrocardiogram (ECG), heart rate, body temperature and exercise. Its algorithms provide clinical-level information such as heart rate (HR), heart rate variabi ...

2021-02 Sensors Infineon Technologies

[Feb 11 2021] Applications such as gaming, virtual e-commerce, and 3D online education connect the real and digital worlds with the augmented reality (AR) function of 3D depth sensors, and the market demand is strong. Infineon technologies has teamed up with pmd technologies to develop a 3D depth sensor with time-of-flight (ToF) technology that far outperforms other solutions on the market and aims to innovate ...

2021-02 Connectors Toshiba Semiconductor and Storage

[Feb 10 2021] Toshiba Electronic Components and Memory Devices Corporation announced the launch of the "TCR3RM Series" consisting of 32 LDO voltage regulators to provide more stable DC power for mobile electronic devices such as smartphones and wearables. The new TCR3RM series combines a bandgap circuit, a low-pass filter (allowing only very low frequencies), and a low-noise high-speed operational amplifier to ...

2021-02 Power ECS

[Feb 10 2021] EPC announced the launch of EPC9148 and EPC9153 demo boards for 48 V DC/DC conversion. The EPC9153 is an ultra-thin 250 W power module with a simple and low-cost synchronous buck configuration with a peak efficiency of up to 98.2% and a maximum component thickness of 6.5 mm. The EPC9148 uses a multilevel topology with a maximum component thickness of less than 4 mm and a peak efficiency of 98%. T ...

2021-02 Passive Components Microchip Technology

[Feb 9 2021] The wave of automotive electrification is sweeping the world, and high-voltage automotive systems such as electric vehicles, on-board chargers, and DC/DC converters all require innovative power technologies such as silicon carbide (SiC). Microchip Technology announced the availability of newly certified 700 and 1200V silicon Carbide (SiC) Schottky Barrier Diode (SBD) power devices, providing elec ...

2021-02 Passive Components Ampleon

[Feb 9 2021] Ampleon announces the BLU9H0408L-800P 800W RF power transistor. It uses the latest Generation 9 (Gen9) (50V) LDMOS process technology from Efulon and is specifically designed for high-power radar systems operating in the 400MHz to 800MHz ultra-high frequency (UHF) band. The BLU9H0408L-800P is ideal for high-power long-range radar systems, supporting the long pulse and high duty ratio requirements ...

2021-02 Power Power Integrations

[Feb 8 2021] Power Integrations, a leading company in the field of energy-efficient power conversion for high voltage integrated circuits, announces MinE-CAP? For high power density, universal input AC-DC converters. IC. The new IC halves the size of high-voltage, high-capacity electrolytic capacitors required for off-line power supplies, reducing the size of the adapter by up to 40 percent. MinE-CAP devices ...

2021-02 Semiconductors Microchip Technology

[Feb 8 2021] As the industry's first highly integrated radiation-hardened design (RHBD) motor control integrated circuit (IC), the LX7720 significantly reduces weight and board space compared to conventional discrete motor control circuits. By reducing the number of components on the system, developers can inspect and test fewer parts, while also reducing the physical points of potential failure due to a redu ...

2021-02 Power Xilinx

[Feb 7 2021] Xilinx, a global leader in adaptive and intelligent computing, announced the launch of Zynq® RFSoC DFE, a new class of ground-breaking adaptive radio platforms designed to meet evolving standards for 5G NR wireless applications. Zynq RFSoC DFE combines hardened digital Front End (DFE) modules with flexible programmable logic to create a high-performance, low-power and cost-effective 5G NR radio s ...