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Micron launched the world's first 176 layer NAND mobile solution, helping 5G ultra fast experience
2022-07
Semiconductors
Micron Technology Inc.
[Jul 22 2022] Micron Technology Inc, a leading provider of memory and storage solutions, announced that the company has begun to ship the world's first universal flash UFS 3.1 mobile solution based on 176 layer NAND technology in bulk. This product is tailored for high-end flagship mobile phones. Compared with the previous generation, it can achieve up to 75% improvement in sequential write and random read per ...

Vishay introduces 7575 size IHLP commercial inductors that can operate continuously at+155 ° C
2022-07
Semiconductors
Vishay
[Jul 22 2022] Vishay Intertechnology, Inc. introduced a new IHLP ultra-thin high current commercial inductor - IHLP ‑ 7575GZ-51, which is also an industry-leading 19 mm x 19 mm x 7 mm 7575 inductor with integrated dimensions. Vishay Dale IHLP ‑ 7575GZ-51 operates at+155 ° C and is suitable for computer, communication and industrial applications. The DC resistance (DCR) is 30% lower than the 6767 device, the ra ...

Toshiba launches TMPM4K development board for motor control
2022-07
Semiconductors
Toshiba Semiconductor and Storage
[Jul 21 2022] Toshiba M4K MCU dedicated MIKROE Clicker 4 development board combined with Clicker 4 inverter expansion board is a cost-effective and simple solution for experimenting BLDC motor control scenarios. Clicker 4 for TMPM4K comes with an onboard debugger, no external debugger is required. Its four mikroBUS™ sockets can be connected to many different MIKROE Click boards™, so it can be expanded for more ...

Microchip released the new Qi 1.3 wireless charging reference design to accelerate the development of cars and consumer Qi transmitters
2022-07
Semiconductors
Microchip Technology
[Jul 21 2022] The Wireless Charging Consortium (WPC) recently released the Qi 1.3 specification, which requires identity authentication when the transmitter and receiver transmit power of no more than 15W to improve security. In order to meet the requirements of this specification, Microchip Technology Inc. today announced the launch of the new Qi 1.3 Wireless charging reference design provides necessary tools ...

Microchip releases a new Ethernet PHY, which supports multi branch bus architecture
2022-07
Semiconductors
Microchip Technology
[Jul 21 2022] As digital networks increasingly connect machines, production line equipment and robots, intelligent manufacturing is improving automation efficiency. Operational technology (OT) and information technology (IT) networks, which are critical to the Industrial Internet of Things (IIoT), rely on Ethernet to achieve interoperability, speed up data transmission and ensure security. Microchip Technology ...

Mouser Electronics and ATP Electronics Sign Global Distribution Agreement
2022-07
Semiconductors
ATOP Technologies
[Jul 21 2022] Mouser Electronics, an authorized global distributor of semiconductor and electronic components focused on new product introductions, announced that it has entered into a global distribution agreement with ATP Electronics. ATP Electronics is a well-known provider of professional storage and memory solutions. Under the agreement, Mouser will distribute ATP Electronics' memory cards, SSDs and manag ...

Bourns introduces the latest micro package size of precision current detection resistor
2022-07
Power
Bourns
[Jul 21 2022] Bourns, a global leading manufacturer of electronic components, announced that its CFN metal foil film current detection resistor series will provide smaller package size and functional options. Bourns ® CFN series introduces new micro 0402 and 0603 packages, and has a lower resistance temperature coefficient option of ± 50 ppm/° C available in 0603 and larger package sizes. Bourns' metal foil te ...

SCHOTT assists the European Extremely Large Telescope (ELT) to provide the 500th sub-mirror for the M1 primary mirror
2022-07
Semiconductors
Schott
[Jul 21 2022] • SCHOTT actively participated in the European Southern Observatory's Extremely Large Telescope project in Chile and successfully produced the 500th sub-mirror for its M1 primary mirror. • SCHOTT mass-produces ZERO® glass-ceramic mirror substrates to meet the highest surface quality requirements of the European Southern Observatory. • Specialty glass maker SCHOTT is producing 949 hexagonal sub-mi ...

Rohm new op amp with excellent anti-interference performance to meet the stringent environmental requirements
2022-07
Semiconductors
Rohm Semiconductor
[Jul 21 2022] With the acceleration of electronic and high-density automotive electronic systems used in electric vehicles and ADAS, the noise environment has become increasingly severe. In general, it is difficult to evaluate the noise of circuit boards and system monomers in automobile development, and it is generally necessary to evaluate after assembly. However, once the evaluation result is NG, large-scal ...

Infineon launched the industry's first radiation resistant NOR flash memory meeting the QML-V standard for aerospace grade FPGAs
2022-07
Semiconductors
Infineon Technologies
[Jul 21 2022] Space grade programmable logic devices (FPGAs) need reliable, high-capacity nonvolatile memories containing their boot configurations. To meet the growing demand for highly reliable memory, Infineon Technologies LLC, a subsidiary of Infineon Technologies, announced the launch of the industry's first high-capacity radiation resistant (RadTol) NOR flash memory product, which passed the MIL-PRF-3853 ...

Infineon launched a new TRENCHSTOP packaged with TO-247-3-HCC 5 WR6 series
2022-07
Semiconductors
Infineon Technologies
[Jul 21 2022] Infineon Technology Co., Ltd. has launched a new 650 V TRENCHSTOP 5 WR6 series with separate packaging. This series adopts TO-247-3-HCC packaging, which can achieve a rich product portfolio with rated currents of 20 A, 30 A, 40 A, 50 A, 60 A and 70 A respectively. It can easily replace the previous generation technologies, such as Infineon TRENCHSTOP 5 WR5 and HighSpeed 3 H3 technologies. The ser ...

Analog Devices Introduces Complete Long-Range Ethernet Solution for Digitalization of Building Automation Networks Embedded Designs
2022-07
Power
Analog Devices
[Jul 21 2022] Analog Devices, Inc. (ADI) introduces a complete 10BASE-T1L Ethernet solution for building automation networks. With the help of networked digital automation equipment, total building management from heating, ventilation and air conditioning to living comfort can be achieved. The new product, ADIN2111, adds long-distance Ethernet connectivity to controllers, sensors and actuators, enabling more e ...