Technology Articles

2024-11 Semiconductors Vishay

[Nov 22 2024] Vishay Intertechnology announced the launch of the new 150 V TrenchFET Gen V N-channel power MOSFET-- SiRS5700DP in PowerPAK SO-8S (QFN 6x5) package. Designed to improve efficiency and power density in communications, industrial and computing applications. The Vishay Siliconix SiRS5700DP has a 68.3 percent reduction in total on-resistance and a 15.4 percent reduction in on-resistance and gate cha ...

2024-11 Power ON Semiconductor

[Nov 22 2024] Onsemi and Wurth Elektronik have jointly announced the incorporation of Wurth Elektronik's passive components database into onsemi’s unique Self-Service PLECS Model Generator (SSPMG). Engineers can generate custom high-fidelity, high-accuracy PLECS models of intricate power electronic applications using this user-friendly web-based platform. This facilitates the early identification and resolutio ...

2024-11 Connectors Infineon Technologies

[Nov 22 2024] Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, and Marelli, a leading technology provider for the automotive industry, are collaborating to develop advanced E/E architecture solutions. The collaboration combines the expertise of both companies in the automotive sector and uses Infineon's latest AURIX™ TC4x microcontroller to develop an innovat ...

2024-11 Power Renesas Electronics America

[Nov 22 2024] Renesas Electronics today announced the launch of the first complete memory interface chipset solution for the second-generation DDR5 multi-capacity dual-in-line memory module (MRDIMM). Increasing memory bandwidth requirements for artificial intelligence (AI), high performance computing (HPC), and other data center applications require new DDR5 MRDIMMs. They operate at speeds of up to 12,800 mega ...

2024-11 Power Molex

[Nov 21 2024] Molex, a global leader in the electronics industry and manufacturer of innovative connectors, has released a forward-looking industry report that looks at the future potential of robots in the field of human-machine communication and collaboration, pointing out that with robotics, we can expect to achieve more intuitive, intelligent and connected interactions. The Molex 2024 Robotics Report: How ...

2024-11 Semiconductors Melexis Technologies NV

[Nov 21 2024] Melexis announced that Geely Automotive Group, a leading automotive manufacturer, has selected Melexis' chips and innovative MeLiBu technology as its Link & Co. The brand's first electric vehicle, the Z10 model, is equipped with advanced daytime running lights (DRL) and full-color lighting dynamic RGB LED taillights. In order to challenge and push the boundaries of vehicle lighting design, Geely ...

2024-11 Sensors ON Semiconductor

[Nov 21 2024] Onsemi announced that it will be the primary supplier of image sensors for Subaru's new generation of EyeSight stereo camera forward-sensing systems for future models. On's advanced Hyperlux AR0823AT image sensor will act as the "eyes" of the system, capturing the critical visual data needed for Subaru's stereo camera AI algorithms to enable the car to make more accurate driving decisions and imp ...

2024-11 Sensors STMicroelectronics

[Nov 21 2024] ST has launched a new web-based tool, ST AIoT Craft, that simplifies the development of node-to-cloud AIoT (Artificial Intelligence for the Internet of Things) projects and associated network configurations on the machine learning kernel (MLC) of ST's intelligent MEMS sensors. The MLC machine learning kernel is a unique feature of the ST MEMS portfolio that enables sensors to run decision tree le ...

2024-11 Sensors LEM

[Nov 20 2024] To facilitate the transition of system engineers in the electric vehicle (EV) industry to transformer-less on-board chargers (OBCs), LEM developed the first automotive-grade residual current monitoring (RCM) type B sensor for bi-directional OBCs with ASIL B capabilities. In recent years, the utilization of bi-directional OBCs has markedly increased, enabling end-users to utilize their vehicle’s b ...

2024-11 Power Nexperia

[Nov 20 2024] Nexperia has introduced a new suite of high-performance gate driver integrated circuits for controlling high - and low-side n-channel MOSFETs in synchronous buck or half-bridge configurations. These devices provide a large number of current outputs and excellent dynamic performance, increasing efficiency and durability in applications. The automotive certified NGD4300-Q100 is suitable for electro ...

2024-11 Power Qorvo US Inc.

[Nov 20 2024] Cambridge GaN Devices (CGD) and Qorvo have partnered to integrate premier motor control and power efficiency technologies in the PAC5556A + ICeGaN evaluation kit (EVK). This partnership integrates Qorvo’s high-performance BLDC/PMSM motor controller/driver with CGD’s user-friendly ICeGaN ICs on a board that markedly enhances motor control applications. CGD asserts that by integrating premier techn ...

2024-11 Connectors STMicroelectronics

[Nov 20 2024] The STGAP3S family of gate drivers from STMicroelectronics for silicon-carbide (SiC) and IGBT power switches integrates advanced galvanic isolation technology, enhanced desaturation protection, and a versatile Miller-clamp architecture. The STGAP3S incorporates enhanced capacitive galvanic isolation between the gate-driving channel and the low-voltage control and interface circuitry, capable of w ...