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| Part Number | THGBMJG9C8LBAU8 |
| OEMstron Part # | THGBMJG9C8LBAU8 |
| Manufacturer | Toshiba Memory America, Inc. |
| Category | Semiconductors › Memory ICs › Memory |
| Description | 512GBIT V5.1 I TEMP EMMC |
| Lifecycle | Active |
| RoHS | No RoHS Information |
| EDA/CAD Models | THGBMJG9C8LBAU8 PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | May 20 - May 25 (Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |  |
| Shipping |  |
THGBMJG9C8LBAU8 Specifications
| Part Number | THGBMJG9C8LBAU8 | |
| Brand | Toshiba Memory America, Inc. | |
| Lifecycle | Active | |
| RoHS | No RoHS Information | |
| Product Line | Semiconductors | |
| Category | Memory ICs | |
| Subcategory | Memory | |
| Manufacturer | Toshiba Memory America, Inc. | |
| Series | e•MMC™ | |
| Memory Type | Non-Volatile | |
| Memory Format | FLASH | |
| Technology | FLASH - NAND | |
| Memory Size | 512Gb (64G x 8) | |
| Memory Interface | eMMC | |
| Clock Frequency | - | |
| Write Cycle Time - Word, Page | - | |
| Access Time | - | |
| Voltage - Supply | - | |
| Operating Temperature | -40°C ~ 105°C (TA) | |
| Mounting Type | Surface Mount | |
| Package / Case | 153-WFBGA | |
| Supplier Device Package | 153-FBGA (11.5x13) |
THGBMJG9C8LBAU8 Documents
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| Minimum | 1 |
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