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| Part Number | THGBMHG8C4LBAU7 |
| OEMstron Part # | THGBMHG8C4LBAU7 |
| Manufacturer | Toshiba Memory America, Inc. |
| Category | Semiconductors › Memory ICs › Memory |
| Description | 32GB NAND 15NM EMBEDDED MULTIMED |
| Lifecycle | Obsolete |
| RoHS | No RoHS Information |
| EDA/CAD Models | THGBMHG8C4LBAU7 PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | May 7 - May 12 (Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |  |
| Shipping |  |
THGBMHG8C4LBAU7 Specifications
| Part Number | THGBMHG8C4LBAU7 | |
| Brand | Toshiba Memory America, Inc. | |
| Lifecycle | Obsolete | |
| RoHS | No RoHS Information | |
| Product Line | Semiconductors | |
| Category | Memory ICs | |
| Subcategory | Memory | |
| Manufacturer | Toshiba Memory America, Inc. | |
| Series | e•MMC™ | |
| Memory Type | Non-Volatile | |
| Memory Format | FLASH | |
| Technology | FLASH - NAND (MLC) | |
| Memory Size | 32Gb (4G x 8) | |
| Memory Interface | eMMC | |
| Clock Frequency | 200MHz | |
| Write Cycle Time - Word, Page | - | |
| Access Time | - | |
| Voltage - Supply | 2.7V ~ 3.6V | |
| Operating Temperature | -40°C ~ 105°C (TA) | |
| Mounting Type | Surface Mount | |
| Package / Case | 153-WFBGA | |
| Supplier Device Package | 153-WFBGA (11.5x13) |
THGBMHG8C4LBAU7 Documents
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