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| Part Number | TH58BYG3S0HBAI4 |
| OEMstron Part # | TH58BYG3S0HBAI4 |
| Manufacturer | Toshiba Memory America, Inc. |
| Category | Semiconductors › Memory ICs › Memory |
| Description | 8GB SLC BENAND 24NM BGA 9X11 1.8 |
| Lifecycle | Active |
| RoHS | No RoHS Information |
| EDA/CAD Models | TH58BYG3S0HBAI4 PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | May 10 - May 15 (Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |  |
| Shipping |  |
TH58BYG3S0HBAI4 Specifications
| Part Number | TH58BYG3S0HBAI4 | |
| Brand | Toshiba Memory America, Inc. | |
| Lifecycle | Active | |
| RoHS | No RoHS Information | |
| Product Line | Semiconductors | |
| Category | Memory ICs | |
| Subcategory | Memory | |
| Manufacturer | Toshiba Memory America, Inc. | |
| Series | Benand™ | |
| Memory Type | Non-Volatile | |
| Memory Format | FLASH | |
| Technology | FLASH - NAND (SLC) | |
| Memory Size | 8Gb (1G x 8) | |
| Memory Interface | Parallel | |
| Clock Frequency | - | |
| Write Cycle Time - Word, Page | 25ns | |
| Access Time | 25ns | |
| Voltage - Supply | 1.7V ~ 1.95V | |
| Operating Temperature | -40°C ~ 85°C (TA) | |
| Mounting Type | Surface Mount | |
| Package / Case | 63-VFBGA | |
| Supplier Device Package | 63-TFBGA (9x11) |
TH58BYG3S0HBAI4 Documents
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