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MT29F8G08ABACAM71M3WC1

MT29F8G08ABACAM71M3WC1
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For Reference Only

Part Number MT29F8G08ABACAM71M3WC1
OEMstron Part # MT29F8G08ABACAM71M3WC1
Manufacturer Micron Technology Inc.
Category SemiconductorsMemory ICsMemory
Description IC FLASH 8G PARALLEL DIE
Lifecycle Active
RoHS No RoHS Information
EDA/CAD Models MT29F8G08ABACAM71M3WC1 PCB Footprint and Symbol
Warehouses USA, Europe, China, Hong Kong SAR
Estimated Delivery May 11 - May 16 (Choose Expedited Shipping)
Warranty Up to 1 year [Limited-Warranty]*
Payment Wire Transfer, UnionPay, PayPal, Credit Card, Visa, MasterCard, AmericanExpress, Discover, WesternUnion, MoneyGram
Shipping DHL, UPS, FedEx, TNT, EMS, & More Express Delivery

MT29F8G08ABACAM71M3WC1 Specifications

Part Number MT29F8G08ABACAM71M3WC1
Brand Micron Technology Inc.
Lifecycle Active
RoHS No RoHS Information
Product Line Semiconductors
Category Memory ICs
Subcategory Memory
Manufacturer Micron Technology Inc.
Series -
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND
Memory Size 8Gb (1G x 8)
Memory Interface Parallel
Clock Frequency -
Write Cycle Time - Word, Page -
Access Time -
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Die

MT29F8G08ABACAM71M3WC1 Documents

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Part Number Description Stock

MT29F8G08ABACAM71M3WC1L

D# MT29F8G08ABACAM71M3WC1L

Micron Technology Inc

- Trays (Alt: MT29F8G08ABACAM71M3WC1L)

RoHS: Compliant
Americas - 0

MT29F8G08ABACAM71M3WC1

D# MT29F8G08ABACAM71M3WC1

Micron Technology Inc

SLC NAND Flash Parallel 3.3V 8Gbit 1G x 8Bit DIE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: MT29F8G08ABACAM71M3WC1)

Americas - 0
Part Number Description Stock

MT29F8G08ABACAM71M3WC1L

D# MT29F8G08ABACAM71M3WC1L

Micron Technology Inc

(Alt: MT29F8G08ABACAM71M3WC1L)

RoHS: Compliant
Europe - 0

MT29F8G08ABACAM71M3WC1

D# MT29F8G08ABACAM71M3WC1

Micron Technology Inc

SLC NAND Flash Parallel 3.3V 8Gbit 1G x 8Bit DIE (Alt: MT29F8G08ABACAM71M3WC1)

Europe - 0
Part Number Description Stock

MT29F8G08ABACAM71M3WC1

Micron Technology Inc

SLC 8G DIE 1GX8 - Gel-pak, waffle pack, wafer, diced wafer on film

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