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For Reference Only
| Part Number | MT29F32G08CBADAL83A3WC1 |
| OEMstron Part # | MT29F32G08CBADAL83A3WC1 |
| Manufacturer | Micron Technology Inc. |
| Category | Semiconductors › Memory ICs › Memory |
| Description | IC FLASH 32G PARALLEL WAFER |
| Lifecycle | Active |
| RoHS | No RoHS Information |
| EDA/CAD Models | MT29F32G08CBADAL83A3WC1 PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | May 12 - May 17 (Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |  |
| Shipping |  |
MT29F32G08CBADAL83A3WC1 Specifications
| Part Number | MT29F32G08CBADAL83A3WC1 | |
| Brand | Micron Technology Inc. | |
| Lifecycle | Active | |
| RoHS | No RoHS Information | |
| Product Line | Semiconductors | |
| Category | Memory ICs | |
| Subcategory | Memory | |
| Manufacturer | Micron Technology Inc. | |
| Series | - | |
| Memory Type | Non-Volatile | |
| Memory Format | FLASH | |
| Technology | FLASH - NAND | |
| Memory Size | 32Gb (4G x 8) | |
| Memory Interface | Parallel | |
| Clock Frequency | - | |
| Write Cycle Time - Word, Page | - | |
| Access Time | - | |
| Voltage - Supply | 2.7V ~ 3.6V | |
| Operating Temperature | 0°C ~ 70°C (TA) | |
| Mounting Type | Surface Mount | |
| Package / Case | Die | |
| Supplier Device Package | Die |
MT29F32G08CBADAL83A3WC1 Documents
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Global Supply Chains - Reliable and Authorized Distributor Resources
| Part Number | Description | Stock |
|
MT29F32G08CBADAL83A3WC1 D# V36:1790_07218960 Micron Technology Inc |
MLC NAND Flash RoHS: Compliant
|
Americas - 0 |
|
MT29F32G08CBADAL83A3WC1-M D# V36:1790_14245419 Micron Technology Inc |
NAND FLASH 4GX8 DIE-COM 3.3V RoHS: Compliant
|
Americas - 0 |
| Part Number | Description | Stock |
|
MT29F32G08CBADAL83A3WC1 D# MT29F32G08CBADAL83A3WC1 Micron Technology Inc |
MLC NAND Flash Parallel 3.3V 32Gbit 4G X 8bit Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: MT29F32G08CBADAL83A3WC1) RoHS: Compliant
|
Americas - 0 |
|
MT29F32G08CBADAL83A3WC1-M D# MT29F32G08CBADAL83A3WC1-M Micron Technology Inc |
NAND FLASH 4GX8 DIE-COM 3.3V MASS STORAGE - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: MT29F32G08CBADAL83A3WC1-M) RoHS: Compliant
|
Americas - 0 |
| Part Number | Description | Stock |
|
MT29F32G08CBADAL83A3WC1-M D# MT29F32G08CBADAL83A3WC1-M Micron Technology Inc |
NAND FLASH 4GX8 DIE-COM 3.3V MASS STORAGE (Alt: MT29F32G08CBADAL83A3WC1-M) RoHS: Compliant
|
Asia - 0 |
| Part Number | Description | Stock |
|
MT29F32G08CBADAL83A3WC1 D# MT29F32G08CBADAL83A3WC1 Micron Technology Inc |
MLC NAND Flash Parallel 3.3V 32Gbit 4G X 8bit Wafer (Alt: MT29F32G08CBADAL83A3WC1) |
Europe - 0 |
| Part Number | Description | Stock |
|
MT29F32G08CBADAL83A3WC1 D# MT29F32G08CBADAL83A3WC1-ND Micron Technology Inc |
IC FLASH 32GBIT PARALLEL DIE |
Temporarily Out of Stock |
|
MT29F32G08CBADAL83A3WC1-M D# MT29F32G08CBADAL83A3WC1-M-ND Micron Technology Inc |
IC FLASH 32GBIT PARALLEL DIE |
Temporarily Out of Stock |
| Part Number | Description | Stock |
|
MT29F32G08CBADAL83A3WC1 Micron Technology Inc |
OEM/CM QUOTES ONLY | NO BROKERS |
13920 |
| Part Number | Description | Stock |
|
MT29F32G08CBADAL83A3WC1 Micron Technology Inc |
OEM/CM Immediate delivery |
30000 |
| Part Number | Description | Stock |
|
MT29F32G08CBADAL83A3WC1 Micron Technology Inc |
IN stock Immediate delivery |
29985 |
| Part Number | Description | Stock |
|
MT29F32G08CBADAL83A3WC1 Micron Technology Inc |
RFQ |
6101 |
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