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For Reference Only
| Part Number | MT29F256G08EBCAGB16A3WC1-M |
| OEMstron Part # | MT29F256G08EBCAGB16A3WC1-M |
| Manufacturer | Micron Technology Inc. |
| Category | Semiconductors › Memory ICs › Memory |
| Description | TLC 256G DIE 32GX8 |
| Lifecycle | Active |
| RoHS | No RoHS Information |
| EDA/CAD Models | MT29F256G08EBCAGB16A3WC1-M PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | May 14 - May 19 (Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |  |
| Shipping |  |
MT29F256G08EBCAGB16A3WC1-M Specifications
| Part Number | MT29F256G08EBCAGB16A3WC1-M | |
| Brand | Micron Technology Inc. | |
| Lifecycle | Active | |
| RoHS | No RoHS Information | |
| Product Line | Semiconductors | |
| Category | Memory ICs | |
| Subcategory | Memory | |
| Manufacturer | Micron Technology Inc. | |
| Series | * | |
| Memory Type | - | |
| Memory Format | - | |
| Technology | - | |
| Memory Size | - | |
| Memory Interface | - | |
| Clock Frequency | - | |
| Write Cycle Time - Word, Page | - | |
| Access Time | - | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Mounting Type | - | |
| Package / Case | - | |
| Supplier Device Package | - |
MT29F256G08EBCAGB16A3WC1-M Documents
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Global Supply Chains - Reliable and Authorized Distributor Resources
| Part Number | Description | Stock |
|
MT29F256G08EBCAGB16A3WC1-M D# V36:1790_18500077 Micron Technology Inc |
128Gb to 1Tb Asynchronous/Synchronous NAND RoHS: Compliant
|
Americas - 0 |
| Part Number | Description | Stock |
|
MT29F256G08EBCAGB16A3WC1-M D# MT29F256G08EBCAGB16A3WC1-M Micron Technology Inc |
MICMT29F256G08EBCAGB16A3WC1-M 32GX8 NAND - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: MT29F256G08EBCAGB16A3WC1-M) RoHS: Compliant
|
Americas - 0 |
| Part Number | Description | Stock |
|
MT29F256G08EBCAGB16A3WC1-M D# MT29F256G08EBCAGB16A3WC1-M-ND Micron Technology Inc |
TLC 256G DIE 32GX8 |
Temporarily Out of Stock |
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