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For Reference Only
| Part Number | ECF840AAACN-C1-Y3 |
| OEMstron Part # | ECF840AAACN-C1-Y3 |
| Manufacturer | Micron Technology Inc. |
| Category | Semiconductors › Memory ICs › Memory |
| Description | IC DRAM 8G PARALLEL |
| Lifecycle | Obsolete |
| RoHS | No RoHS Information |
| EDA/CAD Models | ECF840AAACN-C1-Y3 PCB Footprint and Symbol |
| Warehouses | USA, Europe, China, Hong Kong SAR |
| Estimated Delivery | May 13 - May 18 (Choose Expedited Shipping) |
| Warranty | Up to 1 year [Limited-Warranty]* |
| Payment |  |
| Shipping |  |
ECF840AAACN-C1-Y3 Specifications
| Part Number | ECF840AAACN-C1-Y3 | |
| Brand | Micron Technology Inc. | |
| Lifecycle | Obsolete | |
| RoHS | No RoHS Information | |
| Product Line | Semiconductors | |
| Category | Memory ICs | |
| Subcategory | Memory | |
| Manufacturer | Micron Technology Inc. | |
| Series | - | |
| Memory Type | Volatile | |
| Memory Format | DRAM | |
| Technology | SDRAM - Mobile LPDDR3 | |
| Memory Size | 8Gb (512M x 16) | |
| Memory Interface | Parallel | |
| Clock Frequency | - | |
| Write Cycle Time - Word, Page | - | |
| Access Time | - | |
| Voltage - Supply | 1.14V ~ 1.95V | |
| Operating Temperature | - | |
| Mounting Type | - | |
| Package / Case | - | |
| Supplier Device Package | - |
ECF840AAACN-C1-Y3 Documents
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Global Supply Chains - Reliable and Authorized Distributor Resources
| Part Number | Description | Stock |
|
ECF840AAACN-C1-Y3 D# ECF840AAACN-C1-Y3 Micron Technology Inc |
LPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-C1-Y3) RoHS: Compliant
|
Americas - 0 |
|
ECF840AAACN-C1-Y3-ES D# ECF840AAACN-C1-Y3-ES Micron Technology Inc |
LPDDR3 8G DIE 256MX32 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: ECF840AAACN-C1-Y3-ES) RoHS: Compliant
|
Americas - 0 |
| Part Number | Description | Stock |
|
ECF840AAACN-C1-Y3 D# ECF840AAACN-C1-Y3-ND Micron Technology Inc |
IC DRAM 8GBIT PARALLEL |
Limited Supply - Call |
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| Quote Limit | No Limit |
| Lead-Time | To be Confirmed |
| Minimum | 1 |
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