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| Datasheet | W25Q128FVEIP |
| File Size | 1,336.79 KB |
| Total Pages | 100 |
| Manufacturer | Winbond Electronics |
| Website | |
| Total Parts | This datasheet covers 3 part numbers |
| Associated Parts | W25Q128FVEIP, W25Q128FVCIP, W25Q128FVBIP |
| Description | IC FLASH 128M SPI 104MHZ 8WSON, IC FLASH 128M SPI 24TFBGA, IC FLASH 128M SPI 24TFBGA |
W25Q128FVEIP - Winbond Electronics
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Manufacturer Winbond Electronics Series SpiFlash® Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NOR Memory Size 128Mb (16M x 8) Memory Interface SPI - Quad I/O, QPI Clock Frequency 104MHz Write Cycle Time - Word, Page 50µs, 3ms Access Time - Voltage - Supply 2.7V ~ 3.6V Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 8-WDFN Exposed Pad Supplier Device Package 8-WSON (8x6) |
Manufacturer Winbond Electronics Series SpiFlash® Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NOR Memory Size 128Mb (16M x 8) Memory Interface SPI - Quad I/O, QPI Clock Frequency 104MHz Write Cycle Time - Word, Page 50µs, 3ms Access Time - Voltage - Supply 2.7V ~ 3.6V Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 24-TBGA Supplier Device Package 24-TFBGA (6x8) |
Manufacturer Winbond Electronics Series SpiFlash® Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NOR Memory Size 128Mb (16M x 8) Memory Interface SPI - Quad I/O, QPI Clock Frequency 104MHz Write Cycle Time - Word, Page 50µs, 3ms Access Time - Voltage - Supply 2.7V ~ 3.6V Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 24-TBGA Supplier Device Package 24-TFBGA (6x8) |