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S1C17F57F401100 Datasheet

S1C17F57F401100 Cover
DatasheetS1C17F57F401100
File Size109.79 KB
Total Pages3
ManufacturerEpson Electronics
Website
Total PartsThis datasheet covers 3 part numbers
Associated Parts S1C17F57F401100, S1C17F57D402000, S1C17F57D00E200
Description IC MCU 16BIT 32KB FLASH 128LQFP, IC MCU 16BIT 32KB FLASH DIE, IC MCU 16BIT 32KB FLASH DIE

S1C17F57F401100 - Epson Electronics

S1C17F57F401100 Datasheet Page 1
S1C17F57F401100 Datasheet Page 2
S1C17F57F401100 Datasheet Page 3

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URL Link

S1C17F57F401100

Epson Electronics

Manufacturer

Epson Electronics America Inc-Semiconductor Div

Series

-

Core Processor

S1C17

Core Size

16-Bit

Speed

4.2MHz

Connectivity

I²C, IrDA, SPI, UART/USART

Peripherals

PWM, WDT

Number of I/O

29

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

2V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

128-LQFP

Supplier Device Package

-

S1C17F57D402000

Epson Electronics

Manufacturer

Epson Electronics America Inc-Semiconductor Div

Series

-

Core Processor

S1C17

Core Size

16-Bit

Speed

4.2MHz

Connectivity

I²C, IrDA, SPI, UART/USART

Peripherals

PWM, WDT

Number of I/O

29

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

2V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

Die

Supplier Device Package

-

S1C17F57D00E200

Epson Electronics

Manufacturer

Epson Electronics America Inc-Semiconductor Div

Series

-

Core Processor

S1C17

Core Size

16-Bit

Speed

4.2MHz

Connectivity

I²C, IrDA, SPI, UART/USART

Peripherals

PWM, WDT

Number of I/O

29

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

2V ~ 3.6V

Data Converters

-

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

Die

Supplier Device Package

-