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| Datasheet | MCP11A1CFNE3 |
| File Size | 3,803.55 KB |
| Total Pages | 158 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 7 part numbers |
| Associated Parts | MCP11A1CFNE3, MC68HC11A1CFNE3R, MCP11A1CFNE3R, MC68HC11A1MFNE, MC68HC11A1CFNE3, MC68HC11A0CFNE3, MC68HC11A1MFNER |
| Description | IC MCU 8BIT ROMLESS 52PLCC, IC MCU 8BIT ROMLESS 52PLCC, IC MCU 8BIT ROMLESS 52PLCC, IC MCU 8BIT ROMLESS 52PLCC, IC MCU 8BIT ROMLESS 52PLCC |
MCP11A1CFNE3 - NXP
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Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type External Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 38 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 256 x 8 Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V Data Converters A/D 8x8b Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 52-LCC (J-Lead) Supplier Device Package 52-PLCC (19.1x19.1) |