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MC9S08QE8CWL Datasheet

MC9S08QE8CWL Cover
DatasheetMC9S08QE8CWL
File Size1,309.83 KB
Total Pages54
ManufacturerNXP
Website
Total PartsThis datasheet covers 14 part numbers
Associated Parts MC9S08QE8CWL, MC9S08QE4CWL, MC9S08QE4CPG, MC9S08QE8CTGR, MC9S08QE4CLCR, MC9S08QE4CTGR, MC9S08QE4CWJ, MC9S08QE8CFM, MC9S08QE8CWJ, MC9S08QE8CLC, MC9S08QE8CPG, MC9S08QE8CTG, MC9S08QE4CLC, MC9S08QE4CTG
Description IC MCU 8BIT 8KB FLASH 28SOIC, IC MCU 8BIT 4KB FLASH 28SOIC, IC MCU 8BIT 4KB FLASH 16DIP, IC MCU 8BIT 8KB FLASH 16TSSOP, IC MCU 8BIT 4KB FLASH 32LQFP

MC9S08QE8CWL - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

22

Program Memory Size

8KB (8K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 10x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

28-SOIC (0.295", 7.50mm Width)

Supplier Device Package

28-SOIC

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

22

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 10x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

28-SOIC (0.295", 7.50mm Width)

Supplier Device Package

28-SOIC

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

12

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 8x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Through Hole

Package / Case

16-DIP (0.300", 7.62mm)

Supplier Device Package

16-DIP

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

12

Program Memory Size

8KB (8K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 8x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

16-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

16-TSSOP

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

26

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 10x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

32-LQFP

Supplier Device Package

32-LQFP (7x7)

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

12

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 8x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

16-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

16-TSSOP

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

16

Program Memory Size

4KB (4K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

256 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 8x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-SOIC (0.295", 7.50mm Width)

Supplier Device Package

20-SOIC

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

26

Program Memory Size

8KB (8K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 10x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

32-VFQFN Exposed Pad

Supplier Device Package

32-QFN (4x4)

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

16

Program Memory Size

8KB (8K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 8x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-SOIC (0.295", 7.50mm Width)

Supplier Device Package

20-SOIC

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

26

Program Memory Size

8KB (8K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 10x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

32-LQFP

Supplier Device Package

32-LQFP (7x7)

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

12

Program Memory Size

8KB (8K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 8x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Through Hole

Package / Case

16-DIP (0.300", 7.62mm)

Supplier Device Package

16-DIP

Manufacturer

NXP USA Inc.

Series

S08

Core Processor

S08

Core Size

8-Bit

Speed

20MHz

Connectivity

I²C, LINbus, SCI, SPI

Peripherals

LVD, PWM, WDT

Number of I/O

12

Program Memory Size

8KB (8K x 8)

Program Memory Type

FLASH

EEPROM Size

-

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

1.8V ~ 3.6V

Data Converters

A/D 8x12b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

16-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

16-TSSOP