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| Datasheet | LPC2290FBD144,551 |
| File Size | 198.51 KB |
| Total Pages | 41 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 2 part numbers |
| Associated Parts | LPC2290FBD144,551, LPC2290FBD144/01,5 |
| Description | IC MCU 16/32BIT ROMLESS 144LQFP, IC MCU 16/32BIT ROMLESS 144LQFP |
LPC2290FBD144,551 - NXP
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Manufacturer NXP USA Inc. Series LPC2200 Core Processor ARM7® Core Size 16/32-Bit Speed 60MHz Connectivity CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals PWM, WDT Number of I/O 76 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 16K x 8 Voltage - Supply (Vcc/Vdd) 1.65V ~ 3.6V Data Converters A/D 8x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 144-LQFP Supplier Device Package 144-LQFP (20x20) |
Manufacturer NXP USA Inc. Series LPC2200 Core Processor ARM7® Core Size 16/32-Bit Speed 60MHz Connectivity CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART Peripherals PWM, WDT Number of I/O 76 Program Memory Size - Program Memory Type ROMless EEPROM Size - RAM Size 64K x 8 Voltage - Supply (Vcc/Vdd) 1.65V ~ 3.6V Data Converters A/D 8x10b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 144-LQFP Supplier Device Package 144-LQFP (20x20) |