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Technology Articles

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Teledyne e2v's unique 5D image sensor provides real-time 2D vision and 3D depth data

2024-04 Sensors Teledyne LeCroy
[Apr 10 2024] Teledyne e2v, a company owned by Teledyne Technologies and a global innovator in imaging solutions, announced the launch of Topaz5D, a full HD CMOS image sensor designed to combine 2D vision with 3D depth map generation. A single Topaz5D sensor for use in challenging lighting conditions provides 3D object depth information based on the detected contrast, making it ideal for a variety of logistics ...
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TDK introduces compact gate drive transformers

2024-04 Connectors TDK
[Apr 9 2024] TDK Corporation (Tokyo Stock Exchange: 6762) has expanded the EPCOS InsuGate Series (B78541A) SMT transformer portfolio with the introduction of two new components. The new element uses a manganese zinc (MnZn) ferrite core, which is compact in size and supports high operating voltages, operating frequencies from 100 kHz to 500 kHz, and operating temperatures from -40°C to +150°C. Ideal for IGBT a ...
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Diodes' small, micropower Hall effect switches are compatible with low voltage chipsets

2024-04 Connectors Diodes Incorporated
[Apr 9 2024] Diodes introduces three new Hall-effect switches, AH1899A/B/S, that operate at low supply voltage and very low static current to extend battery life in mobile and portable devices. The AH1899A/B/S can be used to detect whether the covers and cases of portable electronic devices such as smartphones and tablets are open. It can also be used for proximity detection in digital cameras, game consoles ...
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Microchip introduces CEC1736 real-time platform trust root device

2024-04 Power Microchip Technology
[Apr 8 2024] Microchip Technology makes embedded security solutions more accessible to customers through its CEC1736 TrustFLEX device. The CEC1736 Trust Shield family is a single-chip based platform trust root solution that provides network resilience for data center, telecommunications, networking, embedded computing and industrial applications. As part of the TrustFLEX platform, these devices are partially ...
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Qualcomm has introduced two next-generation audio platforms to enhance the wireless audio experience for high-end and mid-tier earbuds, headphones and speakers

2024-04 Connectors Qualcomm
[Apr 7 2024] Qualcomm Technologies International, Inc. announced the launch of two new advanced audio platforms: the third-generation Qualcomm S3 audio platform and the third-generation Qualcomm S5 audio platform. As the most powerful platforms in their respective families, they will deliver an unprecedented audio experience at the S5 and S3 levels. The third-generation Qualcomm S3 audio platform is designed ...
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Renesas was the first in the industry to introduce a general-purpose 32-bit RISC-V MCU with a self-developed CPU core

2024-04 Connectors Renesas Electronics America
[Apr 1 2024] Renesas Electronics announced the industry's first general purpose 32-bit RISC-V microcontroller (MCU), the R9A02G021, built on an in-house self-developed CPU core. While several MCU vendors have recently joined investment alliances to advance RISC-V product development, Renesas has independently designed and tested a new RISC-V kernel that is now in commercial products and available for sale wor ...
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MDmesh DM9 overjunction MOSFET improves silicon chip energy efficiency

2024-04 Connectors STMicroelectronics
[Apr 1 2024] These silicon-based transistors have excellent on-resistance RDS(on) per chip area and very low gate charge, combined with very low energy loss and excellent switching performance, and the quality factor has become a new market benchmark. St's latest MDmesh DM9 technology ensures a narrower distribution of gate source threshold voltages (VGS(th)), resulting in sharper switching waveforms and lowe ...
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Microchip publishes reference designs that comply with the Qi v2.0 standard and are based on dsPIC33

2024-03 Power Microchip Technology
[Mar 29 2024] With major charger manufacturers, including the automotive industry, committed to implementing the Qi v2.0 (Qi2) standard, Microchip Technology Inc. has released a Qi 2.0 dual-board wireless power transmitter reference design. The Qi2 reference design uses a single dsPIC33 digital signal controller (DSC) to provide efficient control to optimize performance. The Wireless Charging Alliance (WPC) re ...
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OmniVision announces brushless DC motor drive solutions for vehicles

2024-03 Power OmniVision Technologies Inc
[Mar 29 2024] OmniVision introduces a new brushless DC motor driver chip WXMD1705. The chip has features such as ultra-low static power consumption, wide input voltage range, drive and power stages can be powered independently, and supports a rich diagnosis and protection mechanism, providing a richer design choice for motor control of the body. With the increasing demand for comfort and safety of modern vehic ...
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TDK introduces a new dual-chip stray-field 3D position sensor with analog and switching outputs

2024-03 Sensors TDK
[Mar 27 2024] TDK has further expanded the Micronas 3D HAL position sensor family with the new dual-chip sensor HAR 3920-2100 for automotive and industrial applications. It is designed to meet the need for high precision measurement of linear and angular positions in the presence of interference stray fields. Developed according to ISO 26262, the HAR 3920 meets ASIL Level C requirements and is suitable for int ...
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Flash series CMOS image sensors for 3D laser triangulation applications

2024-03 Sensors Teledyne LeCroy
[Mar 27 2024] Teledyne e2v, a company of Teledyne Technologies and a global innovator in imaging solutions, announced the expansion of its Flash™ CMOS image sensor family with the launch of the Flash 2K LSA, The product is specifically designed for laser profile applications that require the use of the Greater Schaim Fleur Angle (LSA). Teledyne e2v's Flash series CMOS image sensors are specifically tailored fo ...
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Infineon introduces OptiMOS™ 6 200 V MOSFETs, setting new industry standards with higher power density and efficiency

2024-03 Connectors Infineon Technologies
[Mar 26 2024] With the introduction of the OptiMOS™ 6 200 V MOSFET product family, Infineon Technologies AG has made a leap forward in motor drive applications. This new product portfolio will provide outstanding performance for applications such as electric motorcycles, micro electric vehicles and electric forklifts. The new MOSFET products have improved on-loss and switching performance, reducing electromagn ...