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TE Connectivity's high-current reflow thermal protection devices help meet demanding automotive electronics reliability requirements

Feb 8 2015 2015-02 Connectors TE Connectivity
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To meet the growing demand for reliability and safety in an extremely demanding automotive environment, TE Circuit Protection, a business unit of TE Connectivity, introduced a High-Current Reflowable Thermal Protection (HCRTP) device.

     To meet the growing demand for reliability and safety in an extremely demanding automotive environment, TE Circuit Protection, a business unit of TE Connectivity, introduced a High-Current Reflowable Thermal Protection (HCRTP) device. This powerful HCRTP device (Model: RTP200HR010SA) is particularly suitable for high-power, high-current automotive applications such as ABS modules, electric plugs and engine cooling fans. HCRTP devices can withstand holding currents of up to 90A at room temperature (23ºC) and 45A at 140ºC. In addition to helping automotive electronics designers meet stringent AECQ automotive standards, including AECQ vibration testing, surface-mounted HCRTP devices speed up the installation process.

 

     Based on TE Circuit Protection's reflow Solderable Thermal Protection (RTP) technology, HCRTP devices help protect electronic systems in the event that power FETs, capacitors or other power components fail due to increased resistance, resulting in thermal loss. This innovative technology uses a one-time electrically activated thermal sensitive process. Prior to activation, HCRTP devices are able to withstand lead-free (Pb) reflow processes at temperatures up to 260°C without opening. After installation, a one-time electrical activation process initiates the lower 210°C thermal threshold. After an activation typically performed at the end of a post-reflow line test, the HCRTP device will open when the critical junction temperature exceeds 210°C.

 

     HCRTP devices are available in low side height (up to 3.7mm) packages and can be installed using industry-standard lead-free surface mount devices (SMDS) and reflow soldering assembly processes. In contrast, radial lead thermal fuses must be installed after reflow soldering, so HCRTP devices enable a cost-effective and easy installation process while optimizing thermal coupling to the printed circuit board (PCB).

 

     Faraz Hasan, senior manager, Global Automotive Strategic Marketing, TE Circuit Protection, said: "As the power of automotive electronics increases, thermal protection devices must handle higher currents to maintain stability. For example, integrated ABS modules that combine ABS, stability regulation, and electronic parking braking can generate significant amounts of heat on input connectors or power MOSFET devices in the event of a failure or failure. Current is extremely high in the event of component failure, and HCRTP devices with high current tolerance can help prevent potential damage events caused by thermal runaway, an important consideration for automotive electronics designers who must comply with AECQ testing standards."

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